Device for gas linear cutting of silicon slice

Abstract

The invention discloses a device for the gas linear cutting of a silicon slice, which comprises a flow controller, a pressure reducing valve, a pressure gauge, a vacuum pump, a vacuum-cavity pressure gauge, a vacuum-cavity temperature control device, a vacuum chamber, a spray head, a masking plate, a silicon slice frame, a post pump and a tail gas processing device, wherein the pressure reducing valve, the vacuum pump, the vacuum-cavity pressure gauge, the vacuum-cavity temperature control device and the post pump are respectively connected with the vacuum chamber, gas enters the vacuum chamber after sequentially passing through the flow controller, the pressure reducing valve and the spray head, then the silicon slice on the silicon slice frame is cut through the masking and the beam convergence and regulation of the masking plate, the temperature of the vacuum chamber is controlled to be under a room temperature environment through the vacuum-cavity temperature control device, and etched tail gas is pumped out of the vacuum chamber through the post pump and enters the tail gas processing device through the post pump. In the invention, chlorine trifluoride is used as etching reaction gas for carrying out cutting processing for the silicon slice, and the problems existing in a traditional technology can be well solved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cutting in semiconductor technology, in particular to a device for gas wire cutting of silicon wafers. Background technique [0002] With the extension of IC manufacturing to smaller process nodes and complex processes, as well as the unique complex structure of MEMS chips, the traditional silicon wafer cutting technology can no longer meet the requirements of the development of semiconductor manufacturing technology. [0003] Traditional silicon wafer cutting (scribing) is generally achieved by high-speed rotation of the scribing wheel. Although this method is simple and practical, and the cutting speed is fast, this cutting method must be accompanied by high-pressure water flow for cooling and cleaning, the pressure and torque generated by the contact between the dicing knife and the silicon wafer, and the impact of the cut silicon chips on the surface. Deadly hazards posed by chips. The...

AI Technical Summary

Problems solved by technology

Although this method is simple and practical, and the cutting speed is fast, this cutting method must be accompanied by high-pressure water flow for cooling and cleaning, the pressure and torque generated by the contact between the dicing knife and the silicon wafer, and the impact of the cut silicon chips on the surface. Deadly Hazards Caused by Chips

The positioning accuracy of this cutting machine is not high, and due to the thickness of the blade, it is difficult to control the cutting line width

Although the new laser cutting technology overcomes some problems existing in the traditional cutting technology, it also has the disadvantages of rough cutting section and expensive equipment.

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