Etching solution

A technology of etching solution and sulfuric acid, which is applied in the manufacture of electrical components, printed circuits, and the removal of conductive materials by chemical/electrolytic methods, can solve the problems of slow etching rate and low efficiency, and achieve slow etching rate and fast etching rate Effect

Pending Publication Date: 2022-01-28
纳然电子技术(苏州)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Said further that the purpose of the present invention is to solve the pinhole that the etching solution of sulfuric acid hydrogen peroxide system produces in the application that reduces copper thickness or forms circuit, cancels the flow process of high-temperature baking; Solve the etching solution etching speed of sodium persulfate system slow, inefficiency Problem: Utilize the anisotropic etching characteristics of the etching solution of the present invention to solve the trapezoidal line caused by sidewall etching when forming line etching, and form a better rectangular line

Method used

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Examples

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Embodiment 1

[0033] Embodiment one, a kind of etchant, is made up of sulfuric acid, hydrogen peroxide, accelerator and stabilizer, and its composition according to mass percentage is:

[0034] Hydrogen peroxide: 15%;

[0035] Sulfuric acid: 0.6%;

[0036] Methanol: 10%;

[0037] Phenylthiourea: 0.1%;

[0038] Water: balance.

[0039] For the etchant of this embodiment 1, use it to reduce copper thickness or form lines under the following conditions: etching temperature is 30°C, and the operation method is spraying; operate according to the following process: etch to reduce copper thickness or form lines → Water washing→micro-etching to remove oxidation→water washing→drying→AOI inspection for surface pinhole defects→slice to confirm the found defects.

[0040] Through the above material ratios, the etching solution in Example 1 can quickly etch the copper surface with an etching rate of 12um / min, and maintain the original copper color, and no pinhole defect occurs on the copper surface,...

Embodiment 2

[0041] Embodiment two, a kind of etchant, is made up of sulfuric acid, hydrogen peroxide, accelerator and stabilizer, and its composition according to mass percentage is:

[0042] Hydrogen peroxide: 10%;

[0043] Sulfuric acid: 0.9%;

[0044] Xylitol: 15%;

[0045] Phenolsulfonic acid: 0.1%;

[0046] Water: balance.

[0047] The etching solution in the second embodiment is used in the same way as the etching solution in the first embodiment.

[0048] Through the above material ratio, the etching solution of the second embodiment can quickly etch the copper surface with an etching rate of 9um / min, and maintain the original copper color, and no pinhole defect occurs on the copper surface.

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Abstract

The invention discloses an etching solution formula, and relates to the field of printed circuit board manufacturing and the field of integrated circuit manufacturing. According to the invention, the etching solution can be provided for reducing the copper thickness and forming the circuit, can improve the poor pinholes in the copper surface and optimize the rectangular circuit section, and meanwhile, improves the etching speed and improves the efficiency. The etching solution is characterized by being composed of sulfuric acid, hydrogen peroxide, an alcohol accelerant and a benzene ring stabilizer, the mass ratio of hydrogen peroxide to sulfuric acid in unit volume is larger than 8: 1, the hydrogen peroxide accounts for 8-30% by mass, the sulfuric acid accounts for 0.3-15% by mass, the alcohol accelerant accounts for 5-20% by mass, and the benzene ring stabilizer accounts for 0-2% by mass.

Description

technical field [0001] The invention relates to the fields of printed circuit board manufacturing and integrated circuit manufacturing, more specifically, relates to the application of reducing copper thickness or forming lines by etching in the manufacturing process of high multilayer circuit boards, HDI circuit boards and carrier boards. Background technique [0002] At present, the etching solution in the printed circuit board manufacturing process has the following systems: etching solution of sulfuric acid / hydrogen peroxide system, etching solution of sodium persulfate / sulfuric acid system, etching solution of sodium hypochlorite / hydrochloric acid system, etching solution of hydrogen peroxide / hydrochloric acid system. The above traditional formulas are very mature, but each has its own shortcomings in specific etching. [0003] When the sulfuric acid / hydrogen peroxide system etchant is used to process substrates with lattice stress, such as substrates that have been ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18H05K3/06
CPCC23F1/18H05K3/067
Inventor 刘志强王桂瑛
Owner 纳然电子技术(苏州)有限公司
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