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Phosphorous compound and preparation method thereof

A compound and alkyl technology, which is applied in the field of high solubility phosphorus-containing compounds and their preparation methods, can solve the problems of inconvenient processing or application, and achieve the effect of excellent solubility and high cracking temperature

Inactive Publication Date: 2010-06-23
CHANG CHUN PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this phosphorus-containing compound itself is almost insoluble to solvents generally used in epoxy resin compositions due to its structure, and it can only be dissolved in solvents with higher polarity. Therefore, if this phosphorus-containing compound is to be used compound, it is bound to use a higher polarity solvent, so it is very inconvenient for processing or application

Method used

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  • Phosphorous compound and preparation method thereof
  • Phosphorous compound and preparation method thereof
  • Phosphorous compound and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] 414.4 grams of (9,10-dihydro-9-oxa-10-phosphophenanthrene-10-oxide-10-yl)-bis(4-hydroxyphenyl)methane (HPP), 176.1 grams of ethylene carbonate Ester (EC), 0.6 g of potassium iodide, and 1000 g of N-methylpyrrolidinone were added to the reaction vessel, mixed and stirred, then heated to 150°C for 8 hours until no more carbon dioxide was produced in the reaction vessel until. After the reaction was completed, the solvent was dried and removed to obtain 468 grams of the reaction product (HPPEC).

[0035] The element composition was analyzed by ESCA, C: 68.5%, H: 5.2%, O: 20.33%, P: 5.97% (when m+n=2, the theoretical value C: 69.32%, H: 5.42%, O: 19.10%, P: 6.16%). The FTIR analysis spectrum of reactant HPP is as follows figure 1 Shown, the FTIR analytical spectrum of product HPPEC is as figure 2 shown; figure 2 Display, 2932cm -1 A strong absorption peak indicates -CH 2 - with connection on top, 1251cm -1 A strong absorption peak indicates that the hydroxyl group...

Embodiment 2

[0037] 207.2 grams of (9,10-dihydro-9-oxa-10-phosphophenanthrene-10-oxide-10-yl)-bis(4-hydroxyphenyl)methane, 45 grams of ethylene oxide, 0.3 g of potassium iodide and 500 g of N-methylpyrrolidone were added to the reaction vessel, mixed and stirred, then heated to 150° C. for 8 hours until no carbon dioxide was generated in the reaction vessel. After the reaction was completed, the solvent was dried to obtain 230 g of the reaction product (HPPEO). The FTIR analysis spectrum of product HPPEO is as Figure 4 shown; Figure 4 Display, 2930cm -1 A strong absorption peak indicates -CH2 - with connection on top, 1251cm -1 A strong absorption peak indicates that the hydroxyl group on the phenol has reacted to an ether group. The softening point of the resin is 87°C.

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Abstract

A phosphorous compound has a structure as shown in formula (I) and is prepared by reacting compound as shown in formula (II) and carbonate alkyl ester. Compared to the phosphorous compound generally used as the fire-resistant additive, the phosphorous compound which has the structure as shown in formula (I) has the characteristics of high pyrolysis temperature and excellent solubility with regards to most high-polar and low-polar organic solvents and is suitable to be used as the fire-resistant additive of thermosetting or thermoplastic resin.

Description

technical field [0001] The present invention relates to a phosphorus-containing compound and its preparation method, in particular to a phosphorus-containing compound with high solubility and its preparation method. Background technique [0002] Nowadays, in order to meet the demands of increasingly finer lines and higher densities, laminates also need to have better electrical properties, mechanical properties and heat resistance. Especially the heat resistance, for the current common FR4 laminates, the glass transition temperature after curing is about 130°C, for the cutting and drilling process of more than 200°C in the printed circuit board process, even above 270°C Welding procedures, this kind of laminate material, may crack or explode during the manufacturing and processing process. Therefore, various laminate materials emphasizing high thermal stability and high glass transition temperature have been actively developed. In addition, another important property for l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07F9/6571C09K21/12C08K5/5313
Inventor 许义政王炳杰杜安邦黄坤源
Owner CHANG CHUN PLASTICS