Liquid resin composition for adhesive, semiconductor device, and process for producing semiconductor device

Abstract

A liquid resin composition for adhesives which comprises a solvent (A), an epoxy resin (B) having two or more epoxy groups per molecule, an epoxy resin hardener (C) having two or more phenolic hydroxy groups per molecule, and a hardening accelerator (D). It is characterized in that the epoxy resin (B) and the epoxy resin hardener (C) have dissolved in the solvent (A) and the hardening accelerator (D), in the temperature range of from ordinary temperature to a temperature to be used in vaporizing the solvent (A), is present as particles of a visually observable size in a varnish (W), i.e., a solution of the epoxy resin (B) and the epoxy resin hardener (C) in the solvent (A), and in an adhesive layer obtained by removing the solvent (A) from the varnish (W) by vaporization, and the hardening accelerator (D), in the temperature range of from a temperature higher than that temperature to be used in vaporizing the solvent (A) to a curing temperature, becomes particles of a size not observable visually or dissolves in the adhesive layer. The liquid resin composition for adhesives has excellent suitability for continuous printing. After solvent removal by vaporization, the resin composition has satisfactory suitability for semiconductor element mounting thereon and, despite this, is nontacky at room temperature.

Description

technical field [0001] The present invention relates to a liquid resin composition for an adhesive, a semiconductor device manufactured using the same, and a method for manufacturing the semiconductor device. Background technique [0002] In recent years, mobile phones, mobile information terminals, DVC (digital video cameras), etc. have developed significantly toward higher functionality, miniaturization, and weight reduction, and there is a strong demand for higher functionality, miniaturization, and weight reduction of semiconductor packages. Therefore, in order to increase the functionality of the semiconductor package, it has been attempted to mount a plurality of semiconductor elements with different functions or a plurality of semiconductor elements with the same function in one package, and in order to reduce the size and weight of The size of the semiconductor element and the size of the package are as close as possible. Therefore, the thinning of the semiconductor...

AI Technical Summary

Problems solved by technology

Stickiness near room temperature causes bonding between support substrates printed with adhesives, and causes problems in automatic transfer of support substrates in the process of mounting semiconductor elements

[0007] However, when it is made into a one-stage curing adhesive, there is a problem caused by the reaction temperature

That is, when using a high-boiling-point solvent that takes time in the drying process, the adhesive is cured before the semiconductor element is mounted, so that the mountability of the semiconductor element is reduced

On the other hand, when the solvent is changed to a solvent with a low boiling point, it dries up in printing, so that the continuous printability deteriorates

In addition, when a large amount of polymer rubber or the like is introduced in order to enhance the mountability of semiconductor elements, it is not preferable because linear dross is generated during continuous printing (for example, refer to Patent Document 4).

In this way, it is difficult to realize an adhesive that is not sticky at around room temperature when semi-cured and has both continuous printing and semiconductor mounting properties.

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