Perfusion method and device of protection glue for chip insulation

A protective glue and chip technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems affecting the long-term stability of protective glue, not taken into account, etc., to improve surface breakdown voltage, good insulation effect, simple structure

Active Publication Date: 2010-07-07
ZHUZHOU CRRC TIMES SEMICON CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] like figure 1 As shown, the traditional insulation protection method is to use a machine or manual mold to pour a layer of protective glue 4 on the edge table of the chip 3, but this glue filling method does not take into account that the glue itself is exposed to the air during t

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  • Perfusion method and device of protection glue for chip insulation
  • Perfusion method and device of protection glue for chip insulation
  • Perfusion method and device of protection glue for chip insulation

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Embodiment Construction

[0032] The present invention will be described in detail below with reference to the drawings and specific embodiments.

[0033] figure 2 It is a schematic flow chart of the protective glue pouring method of the present invention. image 3 It is a schematic diagram of the structure of the protective glue pouring device of the present invention.

[0034] Such as figure 2 As shown, the protective glue pouring method for chip insulation of the present invention includes: a degassing step 100, a chip placement step 200, a glue filling step 300, and a curing step 400.

[0035] In the degassing step 100, first pour the protective glue into figure 2 After the airtight container 1 is shown, the airtight container is evacuated and kept under vacuum for a period of time, so that the air bubbles in the protective glue are discharged due to the negative pressure of the airtight container.

[0036] The protective rubber added is preferably silicone rubber, such as dimethyl silicone rubber, meth...

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Abstract

The invention discloses a perfusion method of protection glue for chip insulation, comprising the following steps: 1) after the protection glue is poured in a closed container, the closed container vacuumizes the protection glue and maintains vacuum for some time; 2) a chip is arranged in a glue perfusion mold; 3) the protection glue is pressurized and poured in the glue perfusion mold; 4) and the chip is taken out after the protection glue is cured. As the closed container is adopted to vacuumize the protection glue, air bubbles in the protection glue are extruded by the protection glue to be discharged due to negative pressure, the cured protection glue forms a compact structure, a protection glue layer has good insulation effect, and therefore the surface breakdown voltage of the chip is enhanced. The invention discloses a device adopting the method to pour the protection glue at the same time.

Description

Technical field [0001] The present invention relates to a chip insulation protection technology, in particular to a protective glue pouring method for chip insulation and a device for pouring protective glue using the method. Background technique [0002] With the advancement of power device manufacturing technology, power thyristors and rectifiers are developing in the direction of large current and high voltage. In order to increase the working voltage of the device, the internal breakdown voltage and the surface breakdown voltage of the chip must be increased at the same time. Regarding the surface breakdown voltage of the chip, in the current technical field, the method commonly used internationally and domestically is to grind one or more angles on the silicon edge mesa of the chip, and then conduct insulation protection in the polished area to reduce The strength of the electric field at the edge of the chip silicon, thereby increasing the surface breakdown voltage of the ...

Claims

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Application Information

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IPC IPC(8): H01L21/56
Inventor 张淮邹冰艳黄建伟吴煜东刘旭君
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD
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