Halogen-free resin glue and film manufactured from same

Abstract

The invention relates to halogen-free resin glue. The resin glue is characterized by comprising a component (A), namely epoxy resin, a component (B), namely a compound hardening agent, a component (C), namely aromatic condensed phosphate, and a component (D), namely a filling material, wherein the compound hardening agent is prepared by mixing benzoxazine (BZ) resin and amino triazine phenolic aldehyde (ATN) resin in a preset proportion; and the filling material comprises aluminium hydroxide and silicon dioxide. Therefore, a film manufactured by impregnating the film in the halogen-free resin glue can have excellent heat resistance and burning resistance, and low hydroscopic property.

Description

technical field [0001] The invention relates to a halogen-free resin glue solution, especially a halogen-free resin glue solution with composite hardener, aromatic condensed phosphoric acid ester and filler. Background technique [0002] At present, the application range and fields of printed circuit boards are quite extensive. Generally, electronic components in electronic products are inserted on printed circuit boards. Today's printed circuit boards are used in order to meet the application range of high-power and high-heat components. The heat dissipation effect of printed circuit boards is developed and researched to improve the heat dissipation efficiency and high power of circuit boards. [0003] The printed circuit board is made of impregnated film (PP), or multiple films such as copper clad laminate (CCL) or copper foil, which are fully pressed by thermal pressing; and the impregnated film is made of glass fiber The cloth is impregnated with an epoxy resin prepreg ...

AI Technical Summary

Problems solved by technology

Another example is the Republic of China Patent No. 583258, which discloses a hardener that utilizes benzoxazine resin (BZ resin) and copolymer resin (ATN resin) of phenols, compounds with triazine rings, and aldehydes in combination. The glue of this composition can improve the flame resistance of the film, but it is recommended to use a large amount of BZ type resin hardener, while the relative amount of ATN resin is relatively small, so although it can increase the Tg of the film and reduce the water absorption of the film , but the film’s tin bleaching result (heat resistance) will be reduced, and the substrate made has the problem of poor toughness and excessive addition will lead to poor heat resistance

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