116 results about "Condensed phosphate" patented technology

A method for producing a set gypsum-containing product comprising an interlocking matrix of set gypsum wherein said method comprises applying to said set gypsum one or more enhancing materials selected from the group consisting of phosphoric acid; condensed phosphoric acids, each of which comprises 2 or more phosphoric acid units; and salts or ions of condensed phosphates, each of which comprises 2 or more phosphate units, and monobasic salts or monovalent ions of orthophosphates.

A condensed phosphate containing an alkaline earth metal is caused to be present on the surface of titanium dioxide fine particles, and as a result, the condensed phosphate is firmly coupled with the fine particles and is barely liberated from the surface of the fine particles into a medium such as a binder or a resin. As a result, photo-functional particles exhibiting durability and dispersion stability are obtained. By use of the photo-functional particles, a powder and a slurry exhibiting excellent photo-functional property, durability, dispersion stability, and hydrophilicity are produced. In addition, by use of the powder and slurry, a polymer composition, a coating agent, a photo-functional formed article, and a photo-functional structure are produced.

Disclosed is a flame-retardant epoxy resin composition characterized by containing (A) an epoxy resin containing 0.5-10 equivalent / kg of oxazolidone rings, (B) an epoxy group-containing phosphazene compound, (C) at least one compound selected from the group consisting of phosphates, condensed phosphates, quinone derivatives of phosphine compounds, and polyphenylene ethers, and (D) at least one curing agent selected from the group consisting of guanidine derivatives, phenol novolacs, bisphenol A novolacs, cresol novolacs and naphthol novolacs.

The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, wherein the polishing additive is selected from the group consisting of pyrophosphates, condensed phosphates, phosphonic acids and salts thereof, amines, amino alcohols, amides, imines, imino acids, nitriles, nitros, thiols, thioesters, thioethers, carbothiolic acids, carbothionic acids, thiocarboxylic acids, thiosalicylic acids, hydroxylates, carbonylates, carboxylates, and acids thereof, and mixtures thereof, (iv) at least one stopping compound, and (v) a polishing pad and / or an abrasive. The invention also provides a method of polishing a substrate comprising contacting a surface of a substrate with the system and polishing at least a portion of the substrate therewith. Moreover, the invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (a) contacting the first metal layer with the system, and (b) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate.

The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz.