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Preparation method of light-emitting diode insulation crystal-bonding adhesive

A technology of solid crystal glue and mass percentage content, applied in the direction of adhesives, etc., can solve the problems of blackening, yellowing of insulating solid crystal glue, increase of light attenuation of white LED, etc., to improve blackening performance, improve thermal conductivity and thermal conductivity. Excellent performance

Active Publication Date: 2012-11-14
JIANGSU WENRUN OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, low-power white light LEDs all use epoxy resin insulating glue as the die-bonding glue. Due to the low thermal conductivity of the insulating die-bonding glue, generally only about 0.2w / m.k, the heat generated by the LED cannot be fast when it is working. Effectively lead out and dissipate heat, and because the insulating glue is made of epoxy resin base material, in the long-term use process, the insulating die-bonding glue will turn yellow and black seriously, which will greatly increase the light attenuation of white LEDs. When used for 1000 hours at 25 degrees, the light attenuation can reach more than 50%, which cannot meet the requirements of lighting-level LEDs on light attenuation

Method used

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  • Preparation method of light-emitting diode insulation crystal-bonding adhesive
  • Preparation method of light-emitting diode insulation crystal-bonding adhesive
  • Preparation method of light-emitting diode insulation crystal-bonding adhesive

Examples

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Effect test

Embodiment 1

[0021] A method for preparing LED insulating crystal-bonding glue, the raw material composition of which is: nano-alumina with a mass percentage of 15%, nano-AlN with a mass percentage of 10%, and the rest being a two-component mixed polystyrene of A and B. Silicone resin, its preparation steps are as follows: (1) adopt the polysiloxane resin of A, B two-component, A component is by the methyl phenyl vinyl polysiloxane resin of 99.9wt% and 0.1wt% Platinum catalyst composition, B component is made up of 80wt% silica gel, 15wt% dimethylhydrogensiloxyphenylsilane and 5wt% diphenylbis(dimethylvinylsiloxy)silane, will A component and B component are mixed according to the mass ratio of 1:1, and stir evenly; (2) add the nano-alumina of 15wt%, then stir, mix evenly, make its viscosity ≥ 35000cps; (3) then Add 10wt% nano-AlN and stir the mixed system evenly.

Embodiment 2

[0023] A method for preparing LED insulating crystal-bonding glue, the raw materials of which are composed of: nano-titanium dioxide with a mass percentage of 5%, nano-magnesia with a mass percentage of 5%, and nano-AlN with a mass percentage of 15%. All the other is the polysiloxane resin of A, B two-component mixing, and its preparation steps are as follows: (1) adopt the polysiloxane resin of A, B two-component, A component is made of 99.92wt% methylphenyl Vinyl polysiloxane resin and 0.08wt% platinum catalyst, B component consists of 83wt% silica gel, 10wt% dimethylhydrogensiloxyphenylsilane and 7wt% diphenylbis(dimethyl Vinyl siloxy) silane composition, the A component and the B component are mixed in a mass ratio of 1:1, and stirred evenly; (2) adding 5wt% nano titanium dioxide and 5wt% nano magnesium oxide and then carrying out Stir and mix evenly to make the viscosity ≥ 35000cps; (3) Then add 15wt% nano-AlN and stir the mixed system evenly.

Embodiment 3

[0025] A method for preparing LED insulating crystal-bonding glue, the raw materials of which are composed of: 10% by mass of nano-alumina, 5% by mass of nano-silicon dioxide, and 10% by mass of nano- AlN, all the other are A, B two-component mixed polysiloxane resin, its preparation steps are as follows: (1) adopt the polysiloxane resin of A, B two-component, A component is made of 99.98wt% methyl Phenylvinyl polysiloxane resin and 0.02wt% platinum catalyst, B component consists of 80wt% silica gel, 15wt% dimethylhydrogensiloxyphenylsilane and 5wt% diphenylbis(di Methyl vinyl siloxy) silane, the A component and the B component are mixed in a mass ratio of 1:1, and stirred evenly; (2) adding 10wt% of nano alumina and 5wt% of nanometer di The silicon oxide is then stirred and mixed evenly to make the viscosity ≥ 35000cps; (3) Then add 10wt% nano-AlN and stir the mixed system evenly.

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Abstract

The invention discloses a preparation method of light-emitting diode (LED) insulation crystal-bonding adhesive. The raw materials comprise 10-20wt% of inorganic nanometer material, 10-20wt% of nano-AlN and the balance polysiloxane resin mixed by component A and component B. The preparation method comprises the following steps: (1) adopting polysiloxane resin containing component A and component B, mixing component A and component B in a weight ratio of 1:1, stirring evenly; (2) adding inorganic nanometer material, then stirring to mix evenly and ensure that the viscosity is not less than 35000cps; and (3) then adding nano-AlN, and stirring the mixed system evenly to obtain the finished product. The insulation crystal-bonding adhesive prepared by the method of the invention has excellent heat conductivity; and as polysiloxane resin is used as base material, the yellowing resistance and blackening resistance are greatly increased and the LED insulation crystal-bonding adhesive of the invention is far superior to the insulation crystal-bonding adhesive using epoxy resin as base material.

Description

technical field [0001] The invention relates to a preparation method of LED insulating crystal-bonding glue. Background technique [0002] With the development of thin, light and small electronic components and electronic equipment, heat conduction and heat dissipation insulation materials have become a crucial issue. For general electronic components, when the temperature exceeds the allowable operating temperature by 8°C, the life span will be reduced by 50%. It can be seen that the quality of thermal design will have a very important impact on the life and reliability of electronic components and electronic equipment. In thermal design, if some good heat-conducting and insulating materials and processes can be provided, considerable economic benefits will be produced. At present, low-power white light LEDs all use epoxy resin insulating glue as the die-bonding glue. Due to the low thermal conductivity of the insulating die-bonding glue, generally only about 0.2w / m.k, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J9/00
Inventor 胡建红
Owner JIANGSU WENRUN OPTOELECTRONICS
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