Bonding method and bonded structure
A bonding method and bonding body technology, applied in bonding methods, surface pretreatment bonding methods, adhesives, etc., can solve the problems of high bonding process, long bonding time, long curing time, etc. Excellent strength
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no. 1 Embodiment approach 》
[0070] figure 1 with figure 2 It is a figure (longitudinal sectional view) for demonstrating 1st Embodiment of the joining method of this invention. be explained, the following description will figure 1 with figure 2 The upper side is called "upper" and the lower side is called "lower".
[0071] [1] First, if figure 1 As shown in (a), the first base material 21 and the second base material 22 are prepared. be explained, figure 1 In (a), the second base material 22 is omitted.
[0072] The constituent materials of the first base material 21 and the second base material 22 are not particularly limited, and examples thereof include polyethylene, polypropylene, ethylene-propylene copolymers, ethylene-acrylate copolymers, ethylene-acrylic acid copolymers, Polybutylene-1, ethylene-vinyl acetate copolymer (EVA) and other polyolefins, cyclic polyolefins, modified polyolefins, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyamide, polyimide , polyamideimide, pol...
no. 2 Embodiment approach 》
[0239] Next, a second embodiment of the joining method of the present invention will be described.
[0240] Figure 4 It is a figure (longitudinal sectional view) for demonstrating the 2nd Embodiment of the joining method of this invention. To be explained, in the following description, the Figure 4 The upper side is called "upper" and the lower side is called "lower".
[0241] The second embodiment of the bonding method will be described below, focusing on points different from the bonding method of the first embodiment, and omitting descriptions of the same matters.
[0242] The bonding method of this embodiment forms the bonding film 3 on the bonding surface (surface) 23 of the first base material 21 and also forms the bonding film 3 on the bonding surface (surface) 24 of the second base material 22 . The first base material 21 and the second base material 22 are bonded together by expressing adhesiveness near the surface 32 of the bonding film 3 included in each of the b...
Embodiment 1
[0314] First, prepare a stainless steel (SUS) substrate of 20 mm in length x 20 mm in width x 40 μm in average thickness as the first base material (substrate), and prepare a polyphenylene sulfide substrate of 20 mm in length x 20 mm in width x 4 μm in average thickness as the second base material (counter substrate). ether (PPS) substrate.
[0315] Next, a polyester-modified silicone material ("XR32-A1612" manufactured by Momentive Performance Materials Co., Ltd., Japan) was prepared in which a polyester resin was connected to the silicone material, and this liquid material was provided on a SUS substrate by a spin coating method to form a Liquid coating.
[0316] Then, the liquid film was dried and cured by heating at 200° C. for 1 hour to form a bonding film (average thickness: about 1 μm) on the SUS substrate.
[0317] Next, use image 3 The shown atmospheric pressure plasma apparatus brought plasma into contact with the bonding film formed on the SUS substrate under the...
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Abstract
Description
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