Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for manufacturing ultra-long microwave high-frequency circuit board

A high-frequency circuit board and manufacturing method technology, which is applied in the manufacture of printed circuits, printed circuits, and removal of conductive materials by chemical/electrolytic methods, etc. production and other problems to achieve the effect of satisfying mass production, improving bonding force and reducing hole wall defects

Inactive Publication Date: 2010-08-18
施吉连
View PDF5 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, domestic ultra-long microwave high-frequency circuit boards adopt segmental drilling in the processing process, but this method is easy to cause aperture displacement, affects product quality and is inefficient
In addition, the current treatment of the hole wall in the production process is to use sodium salt solution and plasma for treatment, but this not only reduces the storage stability of the circuit board, but also produces a large amount of waste liquid and waste gas, which is not conducive to the requirements of "clean production"

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing ultra-long microwave high-frequency circuit board
  • Method for manufacturing ultra-long microwave high-frequency circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0008] exist figure 1 Among them, the present invention is a method for manufacturing an ultra-long microwave high-frequency circuit board, which includes the following steps: Step 1, making a light-painting template: firstly, using GENESIS2000 to sequentially design the template and process the engineering documents according to the production process parameters, Make imposition of the processed files, and then use a high-precision laser photoplotter with a resolution of 10160dpi to photopaint the photopainted files into black negatives, develop, fix, clean and air-dry the photopainted negatives, and then use 100 ×100 microscope to inspect the negatives, and finally use the negatives as the master to copy the brown film with a 3KW exposure machine; Step 2, the production of material cutting and drilling: first use the electric shearing machine to cut out the required super-length according to the size requirements Microwave high-frequency copper-clad laminate, and then wrap t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for manufacturing an ultra-long microwave high-frequency circuit board, comprising the following steps: (1) manufacturing a light potting template; (2) shearing to form an ultra-long combination board, and drilling holes on the ultra-long combination board; (3) metallizing the walls of the holes; (4) making patterns on the ultra-long combination board; (5) electroplating and etching the ultra-long combination board; and (6) forming the ultra-long combination board into the ultra-long microwave high-frequency circuit board. The method for manufacturing the ultra-long microwave high-frequency circuit board has high precision, and the ultra-long microwave high-frequency circuit board manufactured with the method has stable performance and can effectively improve the product quality and the work efficiency.

Description

technical field [0001] The invention relates to a manufacturing method of an ultra-long microwave high-frequency circuit board. Background technique [0002] With the rapid development of electronic informatization, especially the promotion of 3G network, the application of ultra-long microwave high-frequency circuit boards is becoming more and more extensive. At present, domestic ultra-long microwave high-frequency circuit boards adopt segmental drilling in the processing process, but this method is easy to cause aperture displacement, affects product quality and is inefficient. In addition, the current treatment of the hole wall in the production process is to use sodium salt solution and plasma for treatment, but this not only reduces the storage stability of the circuit board, but also produces a large amount of waste liquid and waste gas, which is not conducive to the requirements of "clean production" . Contents of the invention [0003] The invention provides a me...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42H05K3/06
Inventor 施吉连
Owner 施吉连
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com