Developing device and developing method

Abstract

The present invention provides a developing apparatus capable of supplying developer for a substrate highly uniformly and restraining decrease of finished products, a developing method and a storage media. The developing apparatus includes a substrate holder that holds a substrate horizontally; means for atomizing a surface treatment liquid used to improve wettability of the substrate with a developer; a first spray nozzle that sprays the atomized surface treatment liquid onto the substrate; and a developer supply nozzle that supplies a developer onto the substrate to which the substrate treatment liquid has been sprayed. The surface tension of the atomized surface treatment liquid with respect to the substrate is lower than the surface tension of the surface treatment liquid with respectto the substrate. The atomization suppresses the fact that the surface treatment liquid gathers on a certain portion of the surface of the substrate. The surface treatment liquid can be easily supplied onto the entire surface of the substrate, and improve wettability of the substrate with the developer.

Description

technical field [0001] The invention relates to a developing device, a developing method and a storage medium for developing a substrate coated with a resist on the surface and further exposed. Background technique [0002] In the photoresist process, which is one of the semiconductor manufacturing processes, a resist is applied to the surface of a semiconductor wafer (hereinafter referred to as wafer), and the resist is exposed in a predetermined pattern and then developed to form a resist pattern. Generally, such processing is performed using a system in which the application of resist, the application of development, and the development device are connected to an exposure device. [0003] This coating and developing device is provided with a developing unit (developing device) for supplying a developing solution to a wafer coated with a resist and developing the wafer. The development unit includes a substrate holding portion for holding a wafer, and a development proces...

AI Technical Summary

Problems solved by technology

However, if the hydrophobicity of the resist becomes high, even with this method, it may become difficult to form a uniform liquid film for the above-mentioned reasons.

In addition, in order to form a uniform liquid film in these developing methods, it is conceivable to increase the amount of developer supplied to the wafer, but the time required for the developing process will become longer, the throughput will decrease, and the cost will increase.

[0010] Patent Document 1 describes a developing device that sprays a fine mist of developer solution, but it does not deal with the above-mentioned problem, and cannot solve the problem.

Images