Detection device and method for high-power semiconductor laser

Abstract

The invention discloses detection device and method for a high-power semiconductor laser. The device comprises a test bar, a test bar fixing clamp, a condenser lens, a light guide optical fiber and a detector; the test bar is formed by gluing oblique sections of two transparent material bars with the same structure in an opposite and coaxial way, wherein one end of each transparent material bar has a 45 degree oblique section and is plated with a high reflective film specific to the wavelength of a laser diode, and the other end of each transparent material bar has a regular round section; the test bar is arranged on the test bar fixing clamp; the condenser lens is arranged outside one end or two ends of the test bar; and one end of the light guide optical fiber is positioned at the focusof the condenser lens and the other end is connected with the input end of the detector. The invention is applicable to the measurement of high-power semiconductor laser modules of semi-circle shapedor circle shaped packaging structures and has the advantages of simple structure and convenient test operation.

Description

technical field [0001] The invention relates to a high-power semiconductor laser module, in particular to a testing device and method for a high-power semiconductor laser module. Background technique [0002] High-power semiconductor lasers have the advantages of small size, high efficiency, low threshold, and long working life. They are used as solid-state laser pump light sources or direct light sources and have entered the development system. High-power semiconductor laser arrays with kilowatts have also directly entered the industry. application. In many application fields, it is necessary to side pump the laser medium (rod), so there is a high-power semiconductor laser module with a semi-circular or circular packaging structure. At present, it is only possible to test each high-power semiconductor laser module before packaging. The performance of the semiconductor laser is used to infer the performance of the package after forming. The power performance after the packa...

AI Technical Summary

Problems solved by technology

In many application fields, it is necessary to side pump the laser medium (rod), so there is a high-power semiconductor laser module with a semi-circular or circular packaging structure. At present, it is only possible to test each high-power semiconductor laser module before packaging. The performance of the semiconductor laser is used to infer the performance of the package after forming. The power performance after the package will not be greatly affected, but its wavelength will drift due to the difference in the heat dissipation device in the package. The uneven wavelength distribution in the module will cause the pump laser medium to absorb The heat distribution is uneven due to the difference, which leads to the decline of the beam quality and other properties of the entire solid-state laser. Therefore, it is necessary to test the wavelength distribution and relative power distribution of the high-power semiconductor laser modules of these two packaging structures.

Images