YIG harmonic oscillator, YIG oscillator and manufacturing methods thereof

Abstract

The invention discloses a YIG harmonic oscillator, a YIG oscillator and manufacturing methods thereof; the YIG harmonic oscillator comprises a coupling ring and YIG monocrystals which are deployed in the coupling ring, wherein the coupling ring is a coupling ring which is deployed in a multi-layered ceramic substrate according to a preset coupling type through a low-temperature co-fired ferrite process; and the YIG monocrystals are inlaid in the coupling ring and sintered together with the coupling ring through an LTCC process. The YIG harmonic oscillator overcomes the defects of poor consistency, poor precision and the like in the manual winding of the coupling ring, and ensures the consistency and the precision of coupling ring manufacturing.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to an yttrium iron garnet YIG resonator, a YIG oscillator and a manufacturing method thereof. Background technique [0002] Because the YIG harmonic oscillator has a high Q value in the microwave band, its tuning frequency has nothing to do with its size, and its resonance frequency changes linearly under the action of a bias magnetic field. Therefore, YIG resonators are often used to make YIG oscillators and YIG filters. The YIG resonator consists of a YIG single crystal and a coupling ring, and the YIG single crystal generally uses YIG balls or YIG thin films. Such as figure 1 As shown, it is a structural model diagram of two traditional general-purpose YIG resonators, which are general-purpose YIG ball resonators and YIG thin-film resonators in turn. The equivalent circuit diagrams of two structural model harmonic oscillators are as follows: figure 2 As shown, that is, the...

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Problems solved by technology

[0005] The traditional process flow of YIG oscillator is as follows: Figure 4 As shown, the process requires ceramic substrate sputtering lithography, YIG balls need to be fixed in a hand-wound gold wire coupling ring with support rods, and bipolar NPN dies, MMIC amplifiers, and power chips are bonded to ceramic substrates. On the substrate, the broadband oscillation matching circuit, decoupling capacitor, bias choke inductor, and transmission line are connected by gold wire bonding. In mass production, the position consistency of the coupling ring and the ball is poor, and the length of the gold wire bonding is inconsistent, resulting in Device consistency is difficult to guarantee; moreover, the integration level of the YIG oscillator manufactured by the current process is relatively low

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