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Printed wiring board

A printed circuit board and via hole technology, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of reduced insulation reliability, connection reliability, insulation reliability reduction, connection reliability reduction, etc., to prevent The effect of reducing insulation resistance, improving insulation reliability, and improving connection reliability

Inactive Publication Date: 2010-10-06
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If such gaps appear, flux residues or cleaning solution residues tend to remain in the gaps, so in printed wiring boards with a conductor land pitch of 200 μm or less, insulation reliability is likely to decrease
Moreover, such residues will lead to a decrease in the adhesion force, so that the peeling of the solder resist and the underfill material will easily occur, resulting in a decrease in connection reliability.
In addition, since it becomes difficult to fill the underfill material, if a large IC chip is to be mounted, holes are likely to be mixed in the underfill material, reducing connection reliability and insulation reliability.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0093] (1) Production of printed circuit boards

[0094] A double-sided copper-clad laminate (for example, "MCL-E-67" manufactured by Hitachi Chemical Industries, Ltd.) is used as a starting material, and through-hole conductors and conductor circuits are formed on this substrate by a known method. Thereafter, interlayer insulating layers and conductor circuit layers are alternately laminated by a known method (such as "Build-up Multilayer Printed Wiring Board" (written by Kiyoshi Takagi) issued by Nikkan Kogyo Shimbun on June 20, 2000), and at the end In the conductor circuit layer of the outer layer, within 150mm 2 In the connection pad region, a group of connection pads for IC chip mounting consisting of 50×40 connection pads (arranged in a grid) with a thickness of 20 μm, a diameter (connection pad diameter): 120 μm, and a pitch of 150 μm is formed.

[0095] Such connection pads are formed, for example, by the same method as described in JP-A-2000-357762.

[0096] In add...

Embodiment 2

[0129] A printed wiring board was produced in the same manner as in Example 1 except that solder balls having a diameter of 100 μm were mounted. As a result, the solder bump diameter was 100 μm.

Embodiment 3

[0131] A printed wiring board was produced in the same manner as in Example 1 except that solder balls with a diameter of 120 μm were mounted. As a result, the solder bump diameter was 120 μm.

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PUM

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Abstract

The invention provides a printed wiring board, wherein conductor circuits and interlayered resin insulating layers are stacked alternately on the printed wiring board, and the printed wiring board has a lamination layer for electrically connecting conductor circuits located at different layers by via holes. The printed wiring board is provided by arranging a solder resist layer to cover the interlayered resin insulating layer located at the outermost of the lamination layer nad the conductor circuit located at the outermost, forming as a conductor pad a part of the conductor circuit exposed from an opening section arranged on the solder resist layer, and by forming a solder bump on the conductor pad for mounting an electronic component. The connecting reliability and the insulating reliability are improved by permitting a rate (W / D) of a solder bump diameter (W) to the opening diameter (D) of the opening section to be 1.05-1.7, even in a narrow pitch structure where the pitch of the opening section arranged on the solder resist layer is 200[mu]m or less.

Description

[0001] This application is a divisional application of a Chinese invention patent application with an application date of June 28, 2006, an application number of 200680014863.8, and an invention title of "printed circuit board". technical field [0002] The present invention relates to a printed wiring board on which electronic components such as capacitors and ICs are mounted on the surface. Specifically, it relates to a printed wiring board suitable for narrowing the pitch of solder bumps for mounting electronic components. Background technique [0003] When mounting semiconductor elements such as IC chips on a printed wiring board, first, solder bumps are formed on the semiconductor element mounting pads (hereinafter simply referred to as "conductor pads") formed on the printed wiring board. Cover a portion of the conductor pad with a solder mask, leaving only the central portion of the conductor pad exposed. In order to form solder bumps on such conductor pads, the print...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00H05K1/18H05K3/34H05K3/28H01L23/12
CPCH01L2223/54473H05K2201/0191H05K2203/0557H01L2924/15311H01L2224/16H05K2203/041H01L23/544H01L21/4853H01L2224/11334B23K2201/42H01L2224/81801H01L2224/81192H05K2201/099H05K3/3478H01L2224/8121H01L2924/15174H01L2924/01019H01L2924/01078H05K3/3452B23K3/0623H01L2224/81815H01L23/49811H01L2924/0102H01L2924/01079H01L24/81B23K2101/42H01L2224/05568H01L2224/05573H01L2224/16225H01L2924/00014H01L2924/12042H01L2924/14H01L2924/00H01L2224/05599H05K3/28H05K3/34
Inventor 川村洋一郎泽茂树丹野克彦田中宏德藤井直明
Owner IBIDEN CO LTD
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