Anodic phosphorous copper balls and preparation method thereof

Abstract

The invention discloses anodic phosphorous copper balls and a preparation method thereof. The method comprises the following steps of: (1) after yellow phosphorus or red phosphorus and oxygen-free copper are melted by adopting a medium-frequency induction furnace, stirring the melt uniformly through a magnetic stirring tank to obtain phosphorous copper solution; (2) producing a phosphorous copper bar with a diameter of 20 to 50 millimeters by using the phosphorous copper solution prepared in the step (1) and an up-draw process, and continuously stamping the phosphorous copper bar to obtain copper balls of different sizes in different dies; and (3) performing polishing, burr removal, cleaning and drying treatment on the copper balls obtained in the step (2) in turn to obtain the anodic phosphorous copper balls. The anodic phosphorous copper balls have the advantages of compact crystal, thin and small crystal grain, high phosphorous copper film generating speed, exquisite and firm phosphorous copper film texture and dropping resistance, and can reduce the cleaning frequency of an anode, effectively improve the utilization rate of the anode and remarkably improve the copper plating effect.

Description

technical field [0001] The invention relates to a metal material processing method, in particular to an anode phosphor copper ball and a preparation method thereof. Background technique [0002] Anode phosphor copper ball is the main electroplating material in the sulfate bright copper plating process, and is the source of copper ions. Under normal circumstances, there is a layer of black oxide film on the surface of phosphor copper anode, referred to as "black film"; the ideal "black film" should be small grains, easy to regenerate and metabolize, rubbing with hands will reveal the true color of copper, and feel fine. slip. [0003] There are many problems in the existing anode phosphor copper balls, such as anode slime and copper powder are too much, which affects the quality of copper plating, reduces the first-time yield, low copper anode utilization, faster consumption of brightener additives, and cleaning of anode bags and copper plating tanks Frequent and other def...

AI Technical Summary

Problems solved by technology

[0003] There are many problems in the existing anode phosphor copper balls, such as anode slime and copper powder are too much, which affects the quality of copper plating, reduces the first-time yield, and the utilization rate of copper anode Low, faster consumption of brightener additives and frequent cleaning of anode bags and copper plating tanks, etc.

[0004] Nowadays, domestic manufacturers of phosphor bronze only pay attention to and control the content of copper and phosphorus, while ignoring the influence of phosphor bronze metal structure on its performance. In horizontal copper plating (about 100ASF), although its DSA non-copper anode can perform high-speed copper plating and avoid the trouble of adding copper balls, there is no positive copper-dissolving reaction in the overall anode reaction, and all electric energy can only be used for negative gas effect

In this way, the obtained large amount of oxygen or the nascent oxygen with strong oxidizing ability not only does not show any help for copper plating, but also hinders it by counterexample, and oxidizes and cracks various additives one by one, resulting in a large amount of cost. The waste and accelerated pollution of the bath solution will make it difficult to guarantee the quality of the copper plating layer.

[0005]The operating voltage of normal hanging copper is only 2-3V and the current density is only 25ASF, but the overall operating current is as high as hundreds of amperes