Light-emitting diode packaging structure and packaging method thereof

Abstract

The invention relates to the field of optoelectronic packaging and discloses a light-emitting diode (LED) packaging structure and a packaging method thereof. The invention has the following beneficial effects: not passing through a ceramic insulating layer, an LED chip directly keeps away from the low heat conductivity bottleneck, and the heat can not be accumulated in the insulating layer; a metal heat conducting layer can rapidly transfer the heat generated by the LED chip to a metal substrate; the metal substrate has sufficient width and heat dissipation space; and a glass-ceramic insulating layer is manufactured on the metal heat conducting layer by selective laser melting and then a metal electrode layer and external electrodes are manufactured on the glass-ceramic insulating layer, thus not only ensuring insulation of the tube shell with the outside but also having little effect on the overall heat dissipation effect. The required ceramic insulating layer and the metal electrodelayer are formed by laser ablation melting, thus avoiding overall high temperature sintering, dispensing with the high temperature sintering process, saving energy, protecting the environment, enlarging the material types of the selectable metal substrate and being easy to realize industrialization.

Description

technical field [0001] The invention relates to the field of optoelectronic packaging, in particular to a light emitting diode packaging structure and a packaging method thereof. Background technique [0002] The current shell structure of the light-emitting diode is mainly to install the patch-type light-emitting diode chip on the insulating substrate, and then install the electrodes on the circuit on the insulating substrate. The thermal conductivity of the LED is very poor, which becomes the bottleneck of heat dissipation, especially for high-power LEDs, the heat cannot be conducted quickly and accumulates in the LED light-emitting chip, resulting in a decrease in performance and life. [0003] Such as figure 1 The LED in the package is the current mainstream packaging mode, including an epoxy resin layer 11, a patch-type LED light-emitting chip 12, and a metal bracket 13. Wherein the two electrodes of the SMD LED light-emitting chip are respectively connected on two me...

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Problems solved by technology

Wherein the two electrodes of the SMD LED light-emitting chip are respectively connected on two metal supports, there are main problems as follows: 1), the thermal conductivity of the epoxy resin layer 11 is extremely poor, and the completely covered structure causes a large amount of heat in the LED light-emitting chip 12 stacking; 2), according to the thermal resistance calculation formula, R=h / λ*S (S is the heat flow area, h is the distance through which the heat flow passes, and λ is the thermal conductivity), the heat flow area of ​​the metal support 13 is too small and If the length is too large, it is difficult to achieve a good heat dissipation effect

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