Light-emitting diode packaging structure and packaging method thereof
A technology of light emitting diodes and packaging structures, applied in the directions of semiconductor devices, electrical components, circuits, etc., can solve the problems of small heat conduction area of the metal bracket 13, difficult to achieve heat dissipation effect, poor thermal conductivity, etc., and achieves material saving and simple structure. , the effect of strong adaptability
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[0047] In Embodiment 2, the bottom of the metal substrate 301 is set as a rough bottom surface, and a ceramic insulating layer (ie, the second insulating layer 302 ) is formed on the rough bottom surface of the bottom of the metal substrate by thermal spraying. In this embodiment, the first outer electrode 308 and the second outer electrode 309 are respectively welded on the metal electrode layer 307 and the metal heat conduction layer 303 by ultrasonic welding or resistance welding. The metal electrode layer 307 is melted and attached to the glass ceramic insulating layer by a laser ablation method.
[0048] The laser ablation melting method is used to form the required glass ceramic insulating layer and metal electrode layer, which avoids the overall high temperature sintering, does not need to use a high temperature sintering process, saves energy and is environmentally friendly, expands the material types of optional metal substrates, and is easy to achieve industrializatio...
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