Manufacturing method of packaging base plate provided with side surface lines

A manufacturing method and surface circuit layer technology, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as difficulty, high manufacturing cost, and difficulty in improving yield
CN101930929BActive Publication Date: 2012-07-18ASE SHANGHAI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ASE SHANGHAI
Publication Date
2012-07-18

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Abstract

The invention discloses a manufacturing method of a packaging base plate provided with side surface lines. The manufacturing method comprises the following steps of: providing a base plate bar which defines a plurality of base plate units; cutting a plurality of notches on a plurality of sides of the base plate unit of the base plate bar to expose the plurality of side surfaces of the base plate unit, two adjacent side surfaces of the base plate unit sharing the same notch; forming a conductive coating on each side surface of the base plate unit; processing the conductive coating to form a side surface line layer; and cutting the base plate bar to separate the at least one base plate unit after the side surface line layer is machined and formed.
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Description

【Technical Field】

[0001] The present invention relates to a method for manufacturing a substrate for packaging with side surface circuits, and more particularly to a method for manufacturing a substrate for packaging that utilizes slotting of a substrate strip to form side surface circuits on the side surface of a substrate unit. 【Background technique】

[0002] Nowadays, the semiconductor packaging industry has gradually developed various types of packaging structures in order to meet the needs of various high-density packaging. Among them, common packaging structures with substrates include ball grid array (BGA), Pin grid array (PGA), land grid array (LGA), or board onchip (BOC), etc. In the above-mentioned packaging structure, an upper surface of the substrate carries at least one chip, and several pads of the chip are electrically connected to the substrate through a wire bonding or bumping manufacturing process. Several pads on the upper surface. At the same time, a large n...

Claims

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