High-strength and high-conductivity dispersion-strengthened alloy and preparation method thereof

Abstract

The invention relates to a high-strength and high-conductivity dispersion-strengthened alloy, which comprises a copper base, a ceramic dispersion-strengthening phase and a doping element, wherein the ceramic dispersion-strengthening phase may be one or several of ZrO2, Y2O3, MgO, Al2O3 and TiB2 which accounts for 0.1 to 2 mass percent of the copper alloy; and the doping element may be one or several of Ni, Y, Ag, Ti, Zr and Hf which accounts for 0.1 to 1 percent of the copper alloy. In the invention, the problems of ceramic particle agglomeration caused by low bonding performance of the copper and ceramic interface, the roughening of the ceramic particles in sintering and material conductivity reduction caused by the scattering of electrons at the copper and ceramic interface are solved, and the dispersion-strengthened alloy with higher hardness and higher conductivity is obtained. The invention also relates to a preparation method of the high-strength and high-conductivity dispersion-strengthened alloy.

Description

technical field [0001] The invention relates to a copper-based nonferrous alloy, in particular to a high-strength and high-conductivity dispersion-strengthened copper alloy. The invention also relates to a preparation method of the high-strength and high-conductivity dispersion-strengthened copper alloy. Background technique [0002] Dispersion-strengthened copper (DSC) is a high-performance functional material with excellent mechanical properties and good electrical and thermal conductivity. As an important functional material, dispersion-strengthened copper has been widely used in industrial fields such as automobiles, welding electrodes, lead frames, and microwave devices. By adding a small amount of second-phase particles, the dispersion-strengthened copper improves the mechanical strength of the copper alloy while maintaining its good electrical and thermal conductivity. The essence of dispersion strengthening is to use uniformly dispersed ultra-fine particles to hin...

AI Technical Summary

Problems solved by technology

[0005]However, there is a big defect in the method of mechanical alloying or the combination of mechanical alloying and internal oxidation, that is, the ceramic reinforcing phase will Preferentially attached to those undissolved ceramic particles for nuclei growth, which easily leads to the coarsening of the ceramic reinforcement phase and reduces the dispersion of ceramic particles

[0006]In addition, due to the poor electrical conductivity of ceramics, when ceramics are used as a dispersion-strengthened copper reinforcement phase, the electrical conductivity of the dispersion-strengthened copper alloy will inevitably be reduced

The basic principle that the ceramic reinforcement phase affects the conductivity of the alloy is: copper and ceramics have different thermal expansion coefficients, and the internal stress caused by the difference in thermal expansion coefficient will lead to lattice distortion, which will increase the dislocation density around the ceramic dispersed phase. Ceramic particles themselves have poor conductivity, making electrons easy to scatter at the copper-ceramic interface during transmission, thereby reducing the conductivity of the material

Therefore, the traditional method of improving the preparation process of dispersion-strengthened copper cannot fundamentally change the problem that ceramic-reinforced particles reduce the conductivity of dispersion-strengthened copper alloys.