SONOS (Silicon Oxide Nitride Oxide Semiconductor) flash memory unit and formation method thereof
A memory unit and flash technology, applied in electrical components, electric solid-state devices, semiconductor devices, etc., can solve problems such as wiring difficulties, storage unit read and write performance, and response rate that cannot meet high integration requirements, and achieve simple structure and meet the requirements of reading and writing. Write performance and response rate requirements, and the effect of increasing strobe speed
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0038] The forming method of a kind of SONOS flash memory cell that the present invention proposes, concrete step flow chart is as follows image 3 Shown:
[0039] S1. Provide a semiconductor substrate, sequentially form a gate dielectric layer and a gate electrode on the semiconductor substrate, and etch a part to form a selection gate;
[0040] S2. Perform ion doping on the substrate on one side of the selection gate to form a source region, leaving a gap between the source region and the selection gate;
[0041] The specific way is:
[0042] A protective layer is first formed on the surface of the selection gate and the substrate, and sidewalls with a certain thickness are formed on both sides of the selection gate.
[0043] Then use a mask to perform plasma implantation in a predetermined area on the substrate on one side of the selection gate, and do doping to form a source area. The sidewall acts as a blocking layer to protect the substrate under the sidewall from being...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 