Virtual measurement method in batch manufacture procedure and system therefor

Abstract

The invention relates to a virtual measurement method in a batch manufacture procedure and a system therefor. The system comprises a manufacture procedure machine which performs a manufacture procedure on a batch of wafer to be processed and then outputs the processed wafers. Output ports of the manufacture procedure machine are respectively connected with a manufacture procedure control system and an error detection and classification system; an output part close to the manufacture procedure control system is provided with a measurement machine; the manufacture procedure control system, the error detection and classification system and the output port of the measurement machine are respectively with a data receiving engine module input port and a data receiving engine module output port is connected with a computer. In the invention, the advanced manufacture procedure control is adopted, the wafers is analyzed and processed timely by using the industrial statistics method, and then key variables affecting the change of the manufacture procedure can be found out; in addition, a rolling time window is utilized to capture working condition changes of the system, and translates or drifts the adverse impact on modelling so as to improve robustness of the model, reduce cycle time for processing the wafers, improve operation of the manufacture procedure tools and reduce burdens on the measurement tools and the cost of the wafers; moreover. The inference model established by the method and the system of the invention is suitable for fault diagnosis of the manufacture procedure.

Description

technical field [0001] The invention relates to the technical field of virtual measurement of a batch process, in particular to a method and system for virtual measurement and estimation of quality management in semiconductor manufacturing or TFT-LCD (thin film transistor-liquid crystal display) manufacturing processes. Background technique [0002] At present, in the batch process of semiconductors, the sampling inspection method is used to detect the product quality of the production machine, that is, 2 to 3 wafers are extracted from a cassette containing 25 wafers for actual measurement. To monitor whether the quality of the process is stable and determine the quality of the product. The defect of this detection method is: if there is a problem in the manufacturing process of a certain batch of products, it will not be discovered until it is detected, and the process at this time may have produced several batches of defective products, that is: the detection of product de...

AI Technical Summary

Problems solved by technology

The defect of this detection method is: if there is a problem in the manufacturing process of a certain batch of products, it will not be discovered until it is detected, and the process at this time may have produced several batches of defective products, that is: the detection of product defects There is a certain time lag between quality problems and changes in process operating variables, and how to predict product quality in the shortest time is an unsolved problem for semiconductor manufacturers

This requires the use of a large number of measurement tools and a substantial increase in production cycle time, with inevitable measurement delays and complex control issues

[0004] The patent application number is 200610108408.6, titled "Virtual Measurement Estimation and Estimation Model Establishment Method and System for Semiconductor Manufacturing", which discloses a method for establishing an estimation model. The defect of this method is that multiple estimation models need to be established , and use related indicators to select the best prediction model, if multiple estimated related indicators are lower than the given threshold, the system will have no output value

In addition, an estimation model covering all working conditions of the machine is required, otherwise the prediction accuracy of the model will be reduced

[0005] The patent application number is 200610149890.8, and the name is "measurement method and virtual measurement system". It proposes a method of establishing a virtual measurement model based on a neural network. The defect is: when the working conditions of the system change, such as adjusting the process program changes, the model needs to be retrained to produce accurate predictions

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