Dust adhering roller and manufacturing method thereof

Abstract

The invention discloses a dust adhering roller applied in the fields of common printed circuit boards, optical film materials, liquid crystal display panels and the like and a manufacturing method thereof. The clean dust adhering roller at least comprises a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive is prepared from the following substances in part by mass: a, 50 to 60 parts of butyl acrylate; b, 5 to 10 parts of ethyl acrylate; c, 5 to 10 parts of vinyl acetate; d, 1 to 5 parts of hydroxypropyl acrylate; e, 0.2 to 5 parts of acrylic acid; f, 50 to 60 parts of ester solvent; g, 2 to 5 parts of multifunctional cross linker; and h, 0.1 to 0.5 part of acid catalyst. The pressure-sensitive adhesive prepared by the formula is uniformly coated on one side of a foam base material to obtain the clean dust adhering roller. Because the formula of the pressure-sensitive adhesive does not contain a benzene solvent and adopts special monomer materials, the polarity of the adhesive is effectively controlled, a mild adhesive force of the dust adhering roller to the surface of a cleaned material is further ensured, and the dust adhering roller is suitable for direct contact of the printed circuit boards.

Description

technical field [0001] The invention relates to a dust-sticking roller which is in direct contact with the surface of a printed circuit board and an optical film material and a manufacturing method thereof. Background technique [0002] For the surface cleaning of rigid printed circuit boards or partially printed flex boards, the traditional method is a two-step method: that is, the surface of the printed circuit board is first cleaned with a special silicone roller, and then a pressure with a strong adhesive force is used. The dust-sensitive adhesive dust roller is in contact with the silicone resin roller with impurities and foreign matter, and uses the strong adhesion of the pressure-sensitive adhesive to transfer the impurities and foreign matter from the surface of the silicone resin to the pressure-sensitive adhesive, so as to clean the printed circuit. purpose of the board. (like figure 1 shown) [0003] Practice has proved that this traditional method has at least...

AI Technical Summary

Problems solved by technology

[0003] Practice has proved that there are at least three deficiencies in this traditional method: one is that there are quality accidents of short circuit or insulation caused by the silicone resin falling off the printed circuit board; It will gradually decay in the later stage, so there is a risk of accidents that cannot completely transfer impurities, foreign objects, etc. on the silicone resin roller, and because the above-mentioned roller is hard, the fragile printed circuit board is often damaged

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