Novel chemical copper plating method

Abstract

The invention discloses a novel chemical copper plating method. The method comprises steps of degreasing and hole finishing, washing, micro etching, pre-impregnation, activation, washing, dispergation, washing and chemical copper plating. The method is characterized in that: in the degreasing and hole finishing step, a circuit board can be degreased, and more important, high negative electricity is carried in the hole and can adsorb more palladium colloid so that the backlight of a copper layer reaches over level 9; salt-based ammonium sulfate and palladium sulfate solution is adopted in the activation step, and acid mist produced by the traditional palladium colloid is not produced, so the method is environment-friendly and has no any injury to the operating personnel; and in the dispergation step, sulfuric acid and hydrazine sulfate are used for removing ammonium radicals, and the hydrazine can reduce palladium metal into palladium atoms, so copper is better deposited.

Description

【Technical field】

[0001] The present invention relates to a kind of plastic, glass, printed circuit (PCB) board electroless copper plating method, relate to plastic, glass, printed circuit (PCB) board electroless copper plating method in degreasing whole hole, prepreg , activation, degumming steps of the process. 【Background technique】

[0002] At present, with the rapid development of global electronic information technology and communication technology, the printed circuit (PCB) industry has become the largest pillar of the electronic component manufacturing industry worldwide. With the gradual transfer of the global PCB industry to my country, my country's PCB industry has also developed rapidly since the 1990s. It is predicted that with the continuous advancement of my country's manufacturing power to a manufacturing power and the further development of the electronic information industry, my country's PCB output will reach 245 million square meters by 2012.

[0003] I...