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Plated molded article and method for producing the same

A molded product and plating technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems such as inability to form an adhesive coating, and achieve excellent productivity, increased adsorption, and uniform film surface Effect

Active Publication Date: 2013-05-15
ACHILLES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In addition, it is clearly shown in the Examples of Patent Document 1 that a plated film with excellent adhesion cannot be formed without performing the above-mentioned complicated etching treatment and the like.

Method used

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  • Plated molded article and method for producing the same
  • Plated molded article and method for producing the same
  • Plated molded article and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0165] Example 1: Manufacture of plated article

[0166] 1.5 mmol of anionic surfactant Perex OT-P (manufactured by Kao Corporation), 50 mL of toluene, and 100 mL of ion-exchanged water were added, and stirred at 20° C. until emulsified. 21.2 mmol of pyrrole monomer was added to the obtained emulsion, stirred for 1 hour, and then 6 mmol of ammonium persulfate was added to carry out polymerization reaction for 2 hours. After the reaction, the organic phase was recovered and washed several times with ion-exchanged water to obtain conductive polymer particles with an average particle diameter of 50 nm dispersed in toluene. Here, the solid content of the conductive polypyrrole microparticles in the obtained toluene dispersion was about 1.2%, and thereinto was added as a binder at a compounding ratio of 0.5 parts by mass to 1 part by mass of the conductive polypyrrole microparticles. 700 (Arakawa Chemical Industry Co., Ltd., styrene-maleic acid copolymer resin) to obtain a conduct...

Embodiment 2

[0172] As catalyst treatment conditions, use 200ppm palladium chloride-0.01M hydrochloric acid aqueous solution, immerse in this solution at 45°C for 5 minutes, make the size of the catalyst metal adsorbed on the coating layer be 150nm, make the adsorption on the coating layer The amount of catalyst metal is 3.0 μg / cm 2 , except that, it carried out similarly to Example 1, and obtained the plated thing.

Embodiment 3

[0174] As a binder, Alasta-700 (manufactured by Arakawa Chemical Industry Co., Ltd., styrene-maleic acid copolymer resin) was added at a compounding ratio of 0.1 parts by mass to 1 part by mass of the conductive polypyrrole to obtain a conductive polypyrrole coating, Except for this, it carried out similarly to Example 1, and obtained the plated thing.

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Abstract

Disclosed are a plated molded article and a method for producing the same. Specifically disclosed is a plate article wherein a coating layer containing conductive polymer particles and a binder is formed on the surface of a molded article, and a metal plating film is formed on the coating layer by electroless plating through adsorption of a catalyst metal. The binder is present in an amount of 0.1-10 parts by mass per 1 part by mass of the conductive polymer particles, and the coating layer has a thickness of 0.5-100 µm. The sizes of the catalyst metal lumps adsorbed on the coating layer are not more than 150 nm, and the amount of the catalyst metal adsorbed on the coating layer per unit area is from 0.1 µg / cm2 to 3.0 µg / cm2.

Description

technical field [0001] The present invention relates to a plated product of a molded product produced by an electroless plating method and a method for producing the same. Specifically, it relates to a metal plated film having excellent productivity and excellent adhesion to a base material, having no exposed portion on the surface of the film, and having a uniform film surface A plated article of a molded article manufactured by an electroless plating method and a method for manufacturing the same. [0002] In particular, it is suitable for plating for electromagnetic wave shielding of housings and decorative plating for automotive parts and the like. Background technique [0003] Japanese Unexamined Patent Publication No. 2007-100174 (Patent Document 1) discloses a method of forming a plated film with excellent adhesion by electroless plating using a resin molded body (composed of polystyrene resin or polystyrene alloy resin). [0004] However, this method requires multi-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18
CPCC23C18/2086C23C18/30C23C18/1646
Inventor 芦泽弘树铃木贵司中村真弓
Owner ACHILLES CORP