Device for chemical liquid spraying treatment of round lamellar object

A flake-like, chemical liquid technology, applied in the direction of injection devices, semiconductor/solid device manufacturing, electrical components, etc., to achieve the effect of avoiding cross-contamination

Active Publication Date: 2011-03-30
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a device for spraying chemical liquid on circular flake-shaped objects. The device is a single silicon wafer rotary centrifugal processi

Method used

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  • Device for chemical liquid spraying treatment of round lamellar object
  • Device for chemical liquid spraying treatment of round lamellar object
  • Device for chemical liquid spraying treatment of round lamellar object

Examples

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Embodiment Construction

[0024] Such as figure 1 As shown, the entire inventive device includes a circular processing chamber 1, a silicon wafer rotation and lifting mechanism 2 and a movable cover plate 3. The circular processing chamber 1 has an outer layer side wall 11 and an inner layer side wall 13 arranged radially. The layer side wall 11 and the inner layer side wall 13 form a double-layer hollow structure. The inner layer side wall is composed of two or more layers of similarly shaped liquid collection ring I14, collection ring II15 and bottom collection ring 16. The collection ring I14 The collection circle II15 and the bottom collection circle 16 are all concave structures with holes in the center, and the drain pipes I17, II18 and III19 are respectively located at the bottom of the collection circle I14, the collection circle II15 and the bottom collection circle 16, There is an exhaust slit 20 between two adjacent collection rings, and an exhaust pipe 12 is opened on the outer side wall 11...

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Abstract

The invention relates to the field of chemical liquid spraying treatment, in particular to a device for chemical liquid spraying treatment of a silicon wafer or other round lamellar objects, wherein a microelectronic device is further prepared by processing a wafer made of a semiconductor material. The device comprises a processing cavity, a rotating and elevating mechanism and a cover plate, the processing cavity is provided with an outer-layer side wall and an inner-layer side wall which are radially arranged and form a double-layer hollow structure, the inner-layer side wall is formed by stacking two or more layers of collection rings, the collection rings are all concave structures with perforated centers and are provided with drain ports at the bottom, an exhaust seam is arranged between two adjacent connection rings, a round lamellar object is placed on the rotating and elevating mechanism, and the cover plate is in a movable structure. The invention can effectively prevent the problems of acid mist, particle pollution and the like, and when the device is used to spray different chemical liquids, a rotation disc is elevated to different collection rings correspondingly so as to collect different chemical liquids separately and avoid cross pollution.

Description

technical field [0001] The invention relates to the field of chemical liquid spraying treatment, in particular to a device for chemical liquid spraying treatment of silicon wafers and other circular thin objects, and further prepares microelectronic devices by processing semiconductor material wafers. Background technique [0002] At present, many microelectronic devices, including microprocessors and memory, are made on wafers of materials with semiconductor properties. These materials with semiconductor properties are generally silicon, germanium and other compounds, among which silicon is the most widely used. From the original silicon wafer, through many processing steps including wet chemistry such as cleaning and etching, microelectronic devices can be finally made. [0003] Multi-chip spin centrifugation has been widely used in some steps of manufacturing semiconductor devices, and the entire treatment process is carried out in a spin centrifuge processing unit. Thi...

Claims

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Application Information

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IPC IPC(8): B05B13/02B05B15/00B05B15/04H01L21/00
Inventor 陈波陈焱谷德君王永斌
Owner SHENYANG KINGSEMI CO LTD
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