Forming method of dual-damascene structure and semiconductor structure

A dual damascene structure, semiconductor technology, used in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems affecting process yield, insufficient cleanliness, trench and contact hole sidewalls and surface residues and other problems, to achieve the effect of saving process time, saving cost and investment, and excellent isolation performance.
CN101996929AInactive Publication Date: 2011-03-30SEMICON MFG INT (SHANGHAI) CORP +1
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
SEMICON MFG INT (SHANGHAI) CORP
Publication Date
2011-03-30
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention provides a forming method of a dual-damascene structure and a semiconductor structure, wherein, the semiconductor structure comprises a semiconductor substrate, a metal wiring layer positioned on the semiconductor substrate, a barrier layer positioned on the metal wiring layer, an interlayer insulation layer positioned on the barrier layer, a protective layer positioned on the interlayer insulation layer, a trench which passes through the protective layer and is positioned in the interlayer insulation layer, a bottom antireflection layer which fills up the trench and is positioned on the surface of the protective layer, and an isolation layer positioned on the bottom antireflection layer. In the invention, the bottom antireflection layer can be normally used after rework, thus saving expense and process time.
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Description

technical field

[0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for forming a double damascene structure and a semiconductor structure. Background technique

[0002] In recent years, with the improvement of the integration level of semiconductor integrated circuits, the improvement of semiconductor integrated circuit manufacturing equipment and the development of semiconductor process materials, the semiconductor process has been continuously updated.

[0003] In addition to the higher integration and more powerful functions of the prepared semiconductor products, the new semiconductor technology can also reduce the production cost of semiconductor products and improve the competitiveness of semiconductor products.

[0004] In various semiconductor processes of integrated circuits, the formation of photoresist patterns on the surface of thin films is one of the most critical processes in the semiconductor process. The accur...

Claims

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