Laminated ceramic electronic component and method for manufacturing same

Abstract

A conductor pattern layer comprising Ag is formed in a surface layer part of a multilayered ceramic substrate; a migration path of Ag is easily formed between the conductor patterns on the surface under the condition that Ag is diffused during sintering, and the reliability is reduced. In order to form a green ceramic laminate (12) to be fired, first ceramic green layers (1a) which include first conductor patterns (5), (7) and (9) including Ag as a main component and which include a first ceramic material including a first glass component are disposed in surface layer portions. Second ceramic green layers (2a) which include second conductor patterns (6) and (8) including Ag as a main component, which include a second ceramic material containing a second glass component, and which include a composition in which Ag diffuses than more easily in the first ceramic green layer (1a) during firing are disposed in inner layer portions. The green ceramic laminate (12) is fired to produce a multilayer ceramic substrate (14).

Description

technical field [0001] The present invention relates to a multilayer ceramic electronic component and its manufacturing method, and particularly to an improvement for suppressing migration of Ag on the surface of a multilayer ceramic electronic component. Background technique [0002] A multilayer ceramic substrate, which is an example of a multilayer ceramic electronic component, has a plurality of laminated ceramic layers, and usually has conductive patterns formed on the surface and inside. As the conductor pattern, there are, for example, in-plane conductors extending in the planar direction of the ceramic layer and interlayer connection conductors (typically conductors with via holes) extending through the ceramic layer in the thickness direction. [0003] Generally, surface-mount electronic components such as semiconductor devices and chip-type multilayer capacitors are mounted on such a multilayer ceramic substrate, and these surface-mount electronic components are in...

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Problems solved by technology

[0011] However, the above-mentioned method has the problem that not only time is required for firing, but also the process is cumbersome.

On the other hand, a method of firing together after forming a conductor pattern made of a Cu-based conductor is also considered, but in this case, there is a problem that the firing atmosphere is limited and it is difficult to adjust the atmosphere.

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