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Solvent-free high-performance conductive adhesive

A conductive adhesive, high-performance technology, applied in the direction of adhesive type, conductive adhesive, adhesive, etc., can solve the problems of low bonding strength, low electrical conductivity, low thermal conductivity, etc., to increase the carrying capacity and improve the electrical conductivity , Improve the effect of electrical and thermal conductivity

Inactive Publication Date: 2011-04-06
CHINA NAT ELECTRIC APP RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with traditional tin-lead solders, conductive adhesives still have certain disadvantages, such as low bonding strength, electrical conductivity, thermal conductivity, etc. are lower than tin-lead solders, and most of the conductive adhesives used in the market are Contains organic solvents

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Bisphenol F170 16 parts

[0033] Dicyandiamide 1.4 parts

[0034] Amide curing accelerator 0.6 parts

[0035] 2 parts of coupling agent KH560

[0036] Sn / Bi alloy 5 parts

[0037] Flake silver powder 75 parts

[0038] Mix the above ingredients evenly, defoam in vacuum, and then cure at 150°C for 1 hour. The measured volume resistivity is 4.9×10 -4 Ω.cm, the shear tensile strength is 12.5Mpa.

Embodiment 2

[0040] Bisphenol F170 18 parts

[0041] Dicyandiamide 1.5 parts

[0042] Amide curing accelerator 0.5 parts

[0043] 2 parts of coupling agent KH560

[0044] Sn / Bi alloy 8 parts

[0045] Flake silver powder 70 parts

[0046] Mix the above ingredients evenly, defoam in vacuum, and then cure at 150°C for 1 hour. The measured volume resistivity is 3.5×10 -4 Ω.cm, the shear tensile strength is 13.5MPa.

example 3

[0048] Bisphenol F170 11 parts

[0049] Resin GE-31 5 parts

[0050] Dicyandiamide 1.4 parts

[0051] Amide curing accelerator 0.6 parts

[0052] 2 parts of coupling agent KH560

[0053] Sn / Bi alloy 15 parts

[0054] Flake silver powder 65 parts

[0055] Mix the above ingredients evenly, defoam in vacuum, and then cure at 150°C for 1 hour. The measured volume resistivity is 2.1×10 -4 Ω.cm, the shear tensile strength is 13.0MPa

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PUM

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Abstract

The invention discloses a solvent-free high-performance conductive adhesive and belongs to the technical field of LED packaging materials. The conductive adhesive comprises the following raw materials in part by weight: 15 to 25 parts of epoxy resin, 1 to 2 parts of coupling agent, 1 to 2 parts of curing agent, 0.5 to 0.7 part of curing accelerator and 75 to 80 parts of conductive filler. The product is prepared by the following steps of: uniformly mixing and stirring the raw materials and performing vacuum defoaming. By adopting low-viscosity epoxy resin, the viscosity of a resin system is improved, the dispersion of the conductive filler is accelerated, and the electric conductivity and bonding strength of the conductive adhesive are improved when a low-melting point alloy is added. The product has the characteristics of simple preparation technology, low cost, environment friendliness and the like, and has higher conductive performance and shear strength.

Description

technical field [0001] The invention relates to a solvent-free high-performance conductive adhesive, which belongs to the technical field of LED packaging materials. Background technique [0002] Conductive adhesive is composed of resin, conductive filler and additives, which has high conductivity and good bonding strength. Because it has a lower curing temperature than traditional tin-lead solder, the curing process is simple. At the same time, with the development of microelectronics technology, tin-lead solder is increasingly unable to meet the requirements of fine-pitch connection technology, and lead is a toxic metal element worldwide. use has been prohibited. In recent years, conductive adhesives have gradually replaced traditional tin-lead solders in SMT, SMD, PCD and other fields. However, compared with traditional tin-lead solders, conductive adhesives still have certain disadvantages, such as low bonding strength, electrical conductivity, thermal conductivity, et...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J9/02
Inventor 王宏芹王玲万超杜彬赵新胡嘉琦王鹏程何丽娇邓梅玲
Owner CHINA NAT ELECTRIC APP RES INST