Preparing method for non-online solid solution of copper alloy slab band

A technology of copper alloy plate and copper alloy, which is applied in the field of off-line solid solution preparation, can solve the problems of increasing production cost and difficulty in implementation, and achieve the effects of easy operation, low production cost and reduced production cost

Inactive Publication Date: 2012-09-05
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The copper alloy prepared by the above traditional process has the characteristics of high strength and high conductivity, which is suitable for the production of high-strength and high-conductivity copper alloy strips in large quantities, but for the production of small and medium-sized high-strength and high-conductivity copper alloy strips, because the alloy is forged After the slab is too long, solution treatment requires special equipment, such as large heat treatment furnaces, on-line quenching facilities, etc., and the solution treatment and aging process in the production line need to be well coordinated and must be compatible with other processing procedures; equipment A large amount of investment increases production costs and is difficult to implement

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Preparation Process:

[0039] 1. Thermal deformation of copper alloy: According to the alloy casting ingot with Cr 0.4%, Fe ≤0.1%, Ni ≤0.05%, and the balance is Cu, the billet is heated at 850°C and thermally deformed to a cross-sectional size of 20mm× 20mm strip;

[0040] 2. Solution treatment: heat-treated the alloy after thermal deformation, the heating temperature is 970-990 ℃, the holding time is 0.5h, it is taken out of the furnace, and cooled to room temperature with air after it is out of the furnace;

[0041] 3. Secondary heat deformation: the alloy after solid solution treatment is heated and deformed, forged at a heating temperature of 850°C, forged to a cross-sectional size of 7mm×20mm, and cooled with water to the water temperature after forging;

[0042] 4. Cold rolling deformation: After water cooling, the copper alloy is cold rolled to a strip with a cross-sectional size of 3.5mm×20mm;

[0043] 5. Aging treatment: After cold rolling and deformation, th...

Embodiment 2

[0046] Preparation Process:

[0047] 1. Thermal deformation of copper alloy: according to the alloy ingot casting of Cr 1.1%, Fe 0.1%, Ni 0.05% and Cu99.75%, the blank is heated at a temperature of 900°C, and the thermal deformation is until the cross-sectional size is 20mm×20mm. Strip;

[0048] 2. Solution treatment: heat-treated the alloy after thermal deformation, the heating temperature is 990°C, the holding time is 2h, it is taken out of the furnace, and cooled to room temperature with air after being out of the furnace;

[0049] 3. Secondary heat deformation: the alloy after solid solution treatment is heated and deformed, forged, the heating temperature is 900°C, forged to a cross-sectional size of 7mm×20mm, and cooled with water to the water temperature after forging;

[0050] 4. Cold rolling deformation: After water cooling, the copper alloy is cold rolled to a strip with a cross-sectional size of 3.5mm×20mm;

[0051] 5. Aging treatment: After cold rolling and defor...

Embodiment 3

[0054] Preparation Process:

[0055] 1. Thermal deformation of copper alloy: according to the alloy ingot of Cr 0.7%, Fe 0.1%, Ni 0.05% and Cu99.15%, the blank is heated at a temperature of 880°C and thermally deformed to a cross-sectional size of 20mm×20mm. Strip;

[0056] 2. Solution treatment: heat-treated the alloy after thermal deformation, the heating temperature is 980°C, the holding time is 1h, it is taken out of the furnace, and cooled to room temperature with air after being out of the furnace;

[0057] 3. Secondary heat deformation: the alloy after solid solution treatment is heated and deformed, forged at a heating temperature of 875°C, forged to a cross-sectional size of 7mm×20mm, and cooled with water to the water temperature after forging;

[0058] 4. Cold rolling deformation: After water cooling, the copper alloy is cold rolled to a strip with a cross-sectional size of 3.5mm×20mm;

[0059] 5. Aging treatment: After cold rolling and deformation, the copper all...

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Abstract

The present invention discloses a preparing method for non-online solid solution of copper alloy slab band, wherein the constituents of the copper alloy comprises 0.4-1.1wt% of Cr, less than or identical to 0.1% of Fe, less than or identical to 0.05% of Ni, and the rest is Cu. The preparing process comprises: 1, thermal deformation of copper alloy; 2, treatment of solid solution; 3, secondary thermal deformation; 4, cold rolling deformation; 5, ageing treatment; and 6, precision rolling to obtain products. The present invention has the advantages that the production is low, and the method is suitable for medium and small batch production; the fit of hardness and electric conductivity is good; blanks before the solid solution treatment of alloy are shorter and thicker than the blanks before the solid solution treatment of traditional process, so the solid solution treatment is operated easily; after a secondary forging, water is cold, the alloy element Cr is dissolved into copper matrix more fully, so that the alloy element Cr is separated out easily.

Description

technical field [0001] The invention relates to a production process of a copper alloy strip, in particular to a non-line solid solution preparation method of a high-strength and high-conductivity copper alloy strip. Background technique [0002] High-strength and high-conductivity copper alloys are widely used in the fields of electric power, electronics industry and aerospace due to their excellent comprehensive physical and mechanical properties. In recent decades, high-strength and high-conductivity copper alloys have been a research hotspot of scholars at home and abroad. It is difficult to balance the conductivity and strength of copper alloys, that is, the high conductivity leads to low strength, and the high strength makes the conductivity difficult to improve. Therefore, special strengthening methods must be adopted to increase its strength as much as possible while ensuring high conductivity. [0003] Commonly used strengthening methods are: fine grain strengthen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22F1/08C22C9/00
Inventor 宋克兴张彦敏郜建新刘亚民赵培峰张莉刘卫锋闫焉服李红霞贾淑果
Owner HENAN UNIV OF SCI & TECH
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