Cantilever probe structure for providing heavy current and voltage potential measurement

Abstract

The invention discloses a cantilever probe structure for providing heavy current and voltage potential measurement. The cantilever probe structure comprises a plurality of probes with different probe diameters which correspond to the same test point of a chip to be tested, wherein the test point can be a bonding pad or a bump of the chip to be tested for transmitting an input electric signal or an output electric signal of the chip to be tested; a gap is reserved between adjacent probes for isolating the probes from each other, or each probe is coated by an insulating material layer to form electrical insulation so as to avoid short circuiting between the adjacent probes; heavy current or high power signals are transmitted by the probes with larger probe diameters, and low current or low power signals are transmitted by the probes with smaller probe diameters to perform accurate voltage potential measurement; therefore, the probes are prevented from being damaged, the tested current or power range of the chip is widened and the accuracy of the voltage potential measurement is also improved.

Description

technical field [0001] The invention relates to a cantilever probe structure, in particular to a chip for measuring large current and voltage potential. Background technique [0002] Probe card (Probe card) is before the integrated circuit (IC) is packaged (Package), it provides the tester (Tester) to perform electrical testing on the bare chip interface, so as to transmit the input signal required by the chip from the tester to the The chip, and the output signal of the chip is sent to the testing machine to check the electrical function of the chip, and to reject the bad chip and screen out the qualified chip for subsequent packaging. [0003] Probe cards generally include cantilever probes, vertical probe cards or MEMS probe cards, among which cantilever probe cards and vertical probe cards are the most popular in the industry The main commercialized probe cards, such as the epoxy ring probe card (Epoxy Ring Probe Card) and the Kelvin probe (Kelvin Probe), which are cant...

AI Technical Summary

Problems solved by technology

[0004] The probe card has multiple probes, each probe corresponds to a test point of the chip, and is used to contact or approach the test point, such as output / input pads, and the electrical characteristics of the probe directly affect the overall measurement of the probe card Quality and test capability, for example, the impedance characteristics of the probe will affect the impedance matching of the signal, and the size of the needle diameter of the probe directly affects the current or power of the signal that can be measured or transmitted, especially for power management with power supply function Chip or power chip, too high current or power will often damage the probe, but the needle diameter of the probe is too large will increase the interference of the measurement signal

[0005] The disadvantage of the existing technology is that it is impossible to reduce the needle diameter of the probe to reduce signal interference while having a large needle diameter to avoid being damaged by high current or power signals

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