Adhesive for bonding metal heat-conducting piece

A technology of thermal conductive parts and adhesives, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve problems affecting metal bonding applications, low impact resistance, short fatigue life, etc., to achieve low cost, Excellent heat aging resistance and good vibration resistance

Inactive Publication Date: 2011-05-11
姜羽
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the low impact strength and short fatigue life of the previous metal adhesives, the application of metal bonding has been affected.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] The adhesive used for bonding metal heat-conducting parts is characterized in that it is composed of the following components according to the following weight ratio: liquid nitrile rubber-40: E-51 epoxy resin: dihydroamine : resorcinol: copper powder: carbon black: glass powder=35:100:15:1.5:30:2.5:10.

[0012] The preparation and curing method of the adhesive used for bonding metal heat-conducting parts according to the present invention: curing at 90 degrees and 0.2Mpa for 2-3 hours, then raising the temperature to 600 degrees within 1 hour, and curing at this temperature for 4 hours , and finally cured at 150 degrees for 4-5h.

Embodiment 2

[0014] The adhesive used for bonding metal heat-conducting parts is composed of the following components in the following weight ratio: liquid nitrile rubber-40: E-51 epoxy resin: dihydroamine: resorcinol: Copper powder: carbon black: glass powder=30:105:20:2.0:40:3.5:15. Others are with embodiment 1.

Embodiment 3

[0016] The adhesive used for bonding metal heat-conducting parts is composed of the following components in the following weight ratio: liquid nitrile rubber-40: E-51 epoxy resin: dihydroamine: resorcinol: Copper powder: carbon black: glass powder=40:95:10:1.0:20:1.0:6.0. Others are with embodiment 1.

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PUM

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Abstract

The invention relates to an adhesive, in particular to an adhesive for bonding a metal heat-conducting piece. The adhesive consists of the following components in part by weight: 30 to 40 parts of liquid nitrile rubber-40, 95 to 105 parts of E-51 epoxy resin, 10 to 20 parts of dihydroamine, 1.0 to 2.0 parts of resorcinol, 20 to 40 parts of copper powder, 1.0 to 3.5 parts of carbon black and 6.0 to 15 parts of glass powder. Compared with the prior art, the adhesive has a more scientific formula, a simple preparation process, high anti-fatigue performance, high thermal conductivity, high thermal ageing resistance, high vibration resistance, reliable adhesion, high intensity and low cost.

Description

technical field [0001] The invention relates to an adhesive, in particular to an adhesive used for bonding metal heat-conducting parts. Background technique [0002] Metal bonding is a recently emerging technology for connecting metal-to-metal and metal-to-nonmetal solid interfaces. It is different from traditional physical and chemical connection methods in terms of connection form and theory. Metal bonding is a process of forming a solid whole through the infiltration and combination of two solid interfaces with a liquid adhesive at room temperature or medium temperature. Adhesive force is the sum of physical connection force and chemical bond connection force. The bonding interface can not only transmit stress but also be sealed and anti-corrosion, and the surface and the whole can be machined by turning, drilling and milling. However, due to the low impact strength and short fatigue life of the previous metal adhesives, the application of metal bonding is affected. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J109/02C09J11/02
Inventor 姜羽
Owner 姜羽
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