Packaging method for semiconductor devices with bulged pins

Abstract

The invention relates to a packaging method for semiconductor devices with bulged pins, which comprises the following steps of: 1 carrying out pasting and wiring on a lead frame; 2 carrying out plastic package by using metal ribs on the lead frame as divisions to form a plurality of plastic strips; 3 cutting off the metal ribs between neighboring plastic strips and partitioning to form exposed independent pins; and 4 transversely cutting the plastic strips to form a plurality of independent semiconductor devices. By combining and adopting a cutting and packaging method and a pin cut-off type packaging method in the prior art, the invention realizes a semiconductor packaging process with high density, low material consumption and high production rate to produce semiconductor device products with high qualities.

Description

Technical field [0001] The invention relates to a packaging process, in particular to a packaging method for semiconductor devices with protruding pins. Background technique [0002] In the prior art, for the packaging of semiconductor devices, the following two processes can generally be used. [0003] The first is the cutting and packaging method, which specifically includes the following steps: Step 1. SMT: attach the chip to the pre-plated lead frame with the film; the film of the lead frame is attached to the back of the lead frame; the lead frame contains a number of leads Frame unit, each lead frame unit contains a stage and a number of pins; for each lead frame unit, attach the chip to its stage; Step 2. Wiring: For each lead frame unit, Connect the chips and pins with metal wires respectively; Step 3, plastic packaging: plastic packaging the entire lead frame, that is, encapsulating the chip, the table and the pins in the plastic package; Step 4. Uncover the film: the bac...

AI Technical Summary

Problems solved by technology

However, this packaging method has the following disadvantages: 1. Since the cutting process involves cutting the external plastic package and the internal metal pins simultaneously, metal burrs or deformations will occur at the ends of the pins, and it is easy to Delamination between two materials occurs, affecting the quality of semiconductor device products

2. Due to the need to cut horizontally and vertically in the cutting process, it takes a long time, resulting in low productivity

[0006] The semiconductor device is packaged in the above-mentioned lead cut-off packaging method, and the density of the lead frame units arranged on the lead frame is small, so that the material utilization rate is greatly reduced, and great waste is generated.

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