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Photosensitive resin composition containing polyimide resin and novolak resin

A technology of polyimide resin and novolak resin, applied in the field of photosensitive resin compositions, can solve the problems of poor heat resistance of novolak resin, difficulty in developing patterns, etc., and achieves easy control, easy pattern lateral angle, The effect of precise critical dimensions

Inactive Publication Date: 2011-06-15
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Considering that the maximum processing temperature required in the related art is at least 200° C., only photosensitive novolak resin compositions are difficult to exhibit pattern-retaining properties because novolak resins are poor in heat resistance at high temperatures

Method used

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  • Photosensitive resin composition containing polyimide resin and novolak resin
  • Photosensitive resin composition containing polyimide resin and novolak resin
  • Photosensitive resin composition containing polyimide resin and novolak resin

Examples

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specific Embodiment approach

[0071] Hereinafter, the present invention will be described in more detail with reference to the following examples. However, these examples are for illustrative purposes only and do not limit the present invention. In the following examples, all parts and percentages are by weight unless otherwise stated.

Embodiment 1

[0074] m-cresol and p-cresol were mixed in a weight ratio of 5:5 to prepare a novolak resin having a weight average molecular weight based on polystyrene of 4,500. A photosensitizer was prepared by reacting 1 mole of 2,3,4,4'-tetrahydroxybenzophenone with 3 moles of 1,2-diazidonaphthoquinone-5-sulfonyl chloride. 133 g (0.30 mol) of 4,4'-hexafluoroisopropylidene diphthalic anhydride as anhydride with 87 g (0.31 mol) of bis(3-amino-4-hydroxyphenyl) sulfone as diamine and 16 g (0.07 mol) 1,3-bis(3-aminopropyl)tetramethyldisiloxane was reacted at 180° C. for 1 hour to prepare a soluble polyimide resin of formula 2:

[0075]

[0076] 4.5 g of novolac resin, 4 g of photosensitizer and 13.5 g of soluble polyimide resin were dissolved in γ-butyrolactone and ethyl lactate. This solution was filtered through a 0.2 μm membrane to prepare a resin composition.

Embodiment 2

[0078] A photosensitive resin composition was prepared in the same manner as in Example 1 except that 9 g of novolak resin and 9 g of polyimide resin were used.

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Abstract

Provided is a specified resin composition, the photosensitive-heat resistant resin composition comprising a) an alkali-soluble polyimide resin, b) an alkali-soluble novolak resin, c) a photosensitizer, and d) an organic solvent. When the photosensitive heat-resistant resin composition is used, the difference of development between an exposed portion and an unexposed portion in forming patterns is great, and sensitivity, resolution, heat resistance and adhesive properties are very excellent. Especially, the angle of the lateral sides of patterns can be easily controlled by a composition ratio of the resins. Thus, the resin composition can be used in forming a pattern circuit on an insulating layer of an OLED.

Description

technical field [0001] The invention relates to a photosensitive resin composition comprising an alkali-soluble polyimide resin, an alkali-soluble novolac resin, a photosensitizer and an organic solvent. More particularly, the present invention relates to a photosensitive resin composition for forming an insulating film circuit of an electronic device such as an organic light emitting diode (OLED). Background technique [0002] Polyimide resin is stable even at processing temperatures as high as 200°C because of its good heat resistance and has the advantages of high mechanical strength and low dielectric constant. Polyimide resins produce a highly flat surface when applied and are low in impurities that affect device reliability. And fine patterns can be easily realized. Due to these advantages, polyimide resins have been valued as OLED insulating film materials. [0003] There are the following patents on the types of photosensitive polyimide resins, which are mainly us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/037
CPCG03F7/0046G03F7/0233G03F7/40G03F7/037
Inventor 朴灿晓莘惠仁成惠兰金璟晙吴东炫
Owner LG CHEM LTD
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