Multilayer electronic component

A kind of electronic parts, laminated technology, applied in the direction of fixed capacitance parts, electrical components, laminated capacitors, etc., can solve the problem of poor moisture resistance

Active Publication Date: 2011-06-22
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, as mentioned above, since the glass component cannot be contained, pores are likely to be generated in the fi

Method used

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Examples

Experimental program
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Example Embodiment

[0048] Example

[0049] Next, an embodiment of the present invention will be described in detail.

[0050] [Production of ceramic sintered body]

[0051] First, as a ceramic substrate, weigh a prescribed amount of BaCO 3 And TiO 2 Secondly, put these weighed objects into a ball mill together with PSZ (partially stabilized zirconia) balls and pure water, fully mixed and pulverized in a wet type, and dried to obtain a mixed powder.

[0052] Next, the mixed powder is calcined in the air at a temperature of 950°C for 2 hours, and then dry pulverized to produce BaTiO 3 Ceramic raw material powder as the main component.

[0053] Next, ethanol is used as a solvent, a polyvinyl butyral binder is added, and the ceramic raw material powder is mixed and pulverized to obtain a ceramic slurry. Then, a doctor blade method is used to form the ceramic slurry to obtain a ceramic green sheet.

[0054] Next, a conductive paste for internal electrodes mainly composed of Ni is screen-printed on the surface ...

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Abstract

Provided is a multilayer electronic component which has: a ceramic element body (1) wherein an internal electrode (2) having Ni as the main component is embedded; and external electrodes (3a, 3b) which are formed on the both end portions of the ceramic element body (1) and are electrically connected with the internal electrode (2). The external electrodes (3a, 3b) respectively have double layer structures composed of first metal layers (4a, 4b), which are brought into contact with the ceramic element body (1), and second metal layers (5a, 5b) formed on the surfaces of the first metal layers (4a, 4b), and the external electrodes are formed by sintering after the ceramic element body (1) is formed. The first metal layers (4a, 4b) contain at least Ni, and second metal layers (5a, 5b) are formed of Cu. The first metal layers (4a, 4b) are formed of either Ni or a Ni-Cu alloy, and contain 80 atm% or less (including 0 atm%) of Cu, preferably 10-50 atm% of Cu. Thus, in the multilayer electronic component, protrusion of the internal electrode to the sides of the external electrodes is suppressed and the external electrodes having a high density are provided.

Description

technical field [0001] The present invention relates to multilayer electronic components such as multilayer ceramic capacitors. Background technique [0002] Conventionally, laminated electronic components such as laminated ceramic capacitors in which a ceramic sintered body is used as a component substrate are known. [0003] In this type of laminated electronic component, the internal electrodes are embedded in the component substrate. In addition, external electrodes are formed on the surface of the component base. In addition, as an internal electrode material, a base metal material is preferably used in consideration of cost, and Ni, which is suitable for high-temperature firing, is widely used. [0004] On the other hand, as a method of forming the external electrodes, there are methods of simultaneously firing the original ceramic laminate in which the internal electrode material is buried in a sheet form and the external electrode material, and forming a ceramic si...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/12H01G4/252
CPCH01G4/30H01G4/2325
Inventor 永元才规
Owner MURATA MFG CO LTD
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