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Epoxy resin composition and application thereof

A technology of epoxy resin and composition, applied in electrical components, circuits, electrical solid devices, etc., can solve problems such as difficulty in meeting lead-free reflow soldering requirements for high-voltage electrical performance requirements, non-compliance with environmental protection requirements, etc. The effect of high reliability and good molding performance

Active Publication Date: 2015-04-22
HENKEL HUAWEI ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the need to add bromine or antimony flame retardants in the traditional epoxy resin composition so as not to meet the environmental protection requirements; In order to have a considerable flame retardant effect, it is difficult to meet the defects of lead-free reflow soldering requirements and high-voltage electrical performance requirements, thus providing a green environmental protection, high-reliability performance and excellent high-voltage performance that can meet the lead-free high-temperature reflow process. Electrical Properties of Epoxy Resin Compositions

Method used

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  • Epoxy resin composition and application thereof
  • Epoxy resin composition and application thereof
  • Epoxy resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The formulation of the epoxy resin composition is shown in Table 1. Wherein, in formula I, n=10, and the equivalent ratio of novolak resin to epoxy resin is 1.08.

[0043] The preparation method of the epoxy resin composition is as follows: knead the formula in Table 1 on a twin-screw extruder at 100° C., then cool and pulverize.

Embodiment 2

[0045] The formulation of the epoxy resin composition is shown in Table 1. Wherein, n=12 in formula I, m=10 in formula II, and the equivalent ratio of novolak resin to epoxy resin is 0.89.

[0046] The preparation method of the epoxy resin composition is as follows: knead the formula in Table 1 on a twin-screw extruder at 100° C., then cool and pulverize.

Embodiment 3

[0048] The formulation of the epoxy resin composition is shown in Table 1. Wherein, n=15 in formula I, 1=10 in formula III, and the equivalent ratio of novolak resin to epoxy resin is 0.91.

[0049] The preparation method of the epoxy resin composition is as follows: knead the formula in Table 1 on a twin-screw extruder at 100° C., then cool and pulverize.

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Abstract

The present invention relates to an epoxy resin composition, which comprises a mixture of specific epoxy resins, a phenolic resin, a curing promoter, an inorganic filler, and as optional components a release agent and a coupling agent. The epoxy resin composition of the present invention can be used in various electronic applications, such as in environmentally friendly, high voltage SMD packages.

Description

technical field [0001] The invention relates to an epoxy resin composition and its application. Background technique [0002] As a semiconductor encapsulation material, the flame retardant performance of the epoxy resin composition must meet the quality standard of UL-94V-0 flame retardant. In the existing technology, the main method to achieve this quality standard is to add a certain amount of flame retardants. There are many types of flame retardants used at present. The traditional (non-environmental) mainly uses brominated flame retardants and antimony-based flame retardants. Fuel. However, with the strengthening of global environmental protection awareness, countries have drafted environmental protection laws to restrict the use of bromide-containing flame retardants and lead-containing and other harmful substances in electronic products. As early as the early 1990s, the United States, Europe, Japan and other countries realized that with the rapid development of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L61/06C08K13/02C08G59/20H01L23/29
CPCC08G59/3218C08L63/00C08G59/621C08L2666/22
Inventor 谢广超杜新宇张成中成兴明韩江龙
Owner HENKEL HUAWEI ELECTRONICS
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