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Anti-static structure of thermosensitive printing head

A thermal print head, anti-static technology, applied in printing and other directions, can solve the problems of destroying the chip and affecting the service life of thermal printer products.

Active Publication Date: 2012-12-26
XIAMEN HANIN ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The printer is prone to generate a lot of static electricity during the printing process. Improper handling of these static electricity will often damage the chips installed on the PCB circuit board and affect the service life of thermal printer products.

Method used

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  • Anti-static structure of thermosensitive printing head
  • Anti-static structure of thermosensitive printing head

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Such as figure 1 , figure 2 As shown, the present invention is an antistatic structure of a thermal print head, which mainly includes a heat sink 1, a ceramic substrate 2, a PCB circuit board 3 and a metal connector; Note, it can also be other metal connectors such as rivets or buckles.

[0012] The PCB circuit board 3 and the ceramic substrate 2 are connected together by curing glue, and then the components of the ceramic substrate 2 and the PCB circuit board are attached to the heat sink 1, and the heat sink 1 is provided with screw holes 11, and the PCB The circuit board 3 is provided with a through hole 31 passing through the PCB circuit board 3 and the copper skin of the PCB circuit board 3 is exposed on the peripheral surface of the through hole 31, forming an annular exposed ring 32. The through hole 31 and the screw hole on the heat sink 1 11 relative; the fastening screw 4 is a metal screw with a countersunk head, the threaded end of the fastening screw 4 pa...

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PUM

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Abstract

The invention discloses an anti-static structure of a thermosensitive printing head. The printing head comprises a cooling fin, a ceramic substrate and a PCB (Printed Circuit Board), wherein the PCB and the ceramic substrate are connected together through a curing glue and then laminated to the cooling fin; the cooling fin is provided with a mating hole, a through hole corresponding to the mating hole is arranged on the PCB, a copper surface skin on the peripheral surface of the through hole is exposed, and a metal connecting piece penetrates through the mating hole and the through hole so as to electrically lock and connect the cooling fin with the PCB. Because the through hole with exposed copper surface skin is arranged on the PCB and the mating hole corresponding to the through hole is arranged on the cooling fin, the metal connecting piece can be used for realizing the electric conduction between a ground wire on the PCB with the cooling fin, and thus, static electricity on the PCB is effectively eliminated, the anti-static capability of a thermosensitive printer is improved and the service life of a thermosensitive printer product is guaranteed.

Description

technical field [0001] The invention relates to a printer, in particular to an antistatic structure of a thermal print head. Background technique [0002] The use of thermal printers is becoming more and more widespread. The thermal print head is an important part of the thermal printer. The basic printing principle of the thermal printer using the thermal print head: the DATA terminal of the drive circuit and the CLK signal are input at the same time, and the drive circuit is equipped with The shift register and the latch are energized within a certain period of time through the STROBE signal control, and the switch of the transistor transistor is controlled according to the input data and the recorded voltage of the pre-printed frame, so that the current passes through the heating element resistance, and the Joule heat generated by the heating element resistance is conducted to the On the thermal paper above it, so as to print text or image on the corresponding part of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41J2/335
Inventor 张承志
Owner XIAMEN HANIN ELECTRONICS TECH CO LTD