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Heat pipe radiator

A heat pipe radiator, heat pipe technology, applied in the direction of electric solid device, semiconductor device, semiconductor/solid state device parts, etc., can solve the problems of increasing the weight of lighting fixtures, poor heat dissipation effect, and rising junction temperature of LED chips, and achieves processing and manufacturing. And the effect of convenient installation and layout, simple and reasonable structure, and satisfying heat dissipation requirements

Inactive Publication Date: 2011-07-13
安徽瑞煌光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to meet the heat dissipation requirements, it is often necessary to increase the heat dissipation area of ​​the lamp shell, which increases the weight of the entire lighting fixture on the one hand, which is inconvenient to use, and on the other hand, it will inevitably increase the manufacturing cost.
Especially for high-power LEDs with a power of several watts to hundreds of watts used in lighting, if no heat dissipation measures are taken, the junction temperature of the LED chip will rise rapidly, resulting in a sharp decrease in the light output rate and life of the LED, especially when the junction temperature When rising above the maximum allowable temperature, the LED will fail due to overheating
The currently used LED heat dissipation technology solutions have various defects and deficiencies such as poor heat dissipation effect and poor reliability, which greatly limit the wide application of high-power LED lights.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Such as figure 1 , image 3 and Figure 4 As shown, a heat pipe radiator provided by the present invention includes a heat pipe 1, a metal heat sink 2, a heat conduction bolt 3, and a plastic heat conduction material. The middle part is the uniform temperature heat conductor 4, and the heat dissipation fins 5 are symmetrically distributed on both sides of the temperature uniform heat conductor 4. The surface shape of the heat dissipation fins 5 is a concave-convex corrugated surface, and there are gaps between adjacent fins; The middle part of the metal radiator 2 is provided with a heat pipe perforation 6, and the heat pipe 1 is connected through the heat pipe perforation 6 with the metal radiator 2; Connected heat conduction fastening holes 7; the diameter of the heat conduction fastening holes 7 may be larger or smaller than the heat pipe through holes 6, and the number is one or more than two.

[0020] The thread specification of the heat conduction bolt 3 is co...

Embodiment 2

[0023] Such as figure 2 As shown, in this embodiment, the difference from the embodiment is that the metal radiator

[0024] During actual processing and production, the size of the heat pipe 1 and the number of metal radiators 2 can be adjusted accordingly according to specific needs, and then the determined number of metal radiators 2 will be installed on the heat pipe 1, and the metal radiator 2 Angle adjustment of 360° is possible. Preferably, the heat dissipation fins 5 on the metal heat dissipation body 2 should be placed at a perpendicular angle to the heat pipe 1, which is conducive to air convection, improves its heat dissipation effect, and can avoid dust accumulation. The heat dissipation effect is not affected, and the service life of the radiator can be improved.

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PUM

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Abstract

The invention discloses a heat pipe radiator which comprises a heat pipe, a metal heat radiation body, heat conduction bolts and plastic heat conduction material, wherein the middle part of the metal heat radiation body is the temperature uniformization and heat conduction part, heat radiation fins are symmetrically distributed on two sides of the temperature uniformization and heat conduction part, a heat pipe through hole is arranged at the middle part of a metal, the heat pipe penetrates the metal heat radiation body and is connected with the metal heat radiation body through the heat pipe through hole, heat conduction fastening holes which are communicated with the heat pipe through hole are arranged on two sides which are adjacent to the heat radiation fins in the metal heat radiation body, the heat conduction bolts are matched and arranged in the heat conduction fastening holes, one end surface of each heat conduction bolt is tangential to the outer wall of the heat pipe, and the plastic heat conduction material is filled in the heat pipe and the heat pipe through hole, as well as gaps between the end surfaces of the heat conduction bolts, which are tangential to the heat pipe, and threads. The heat pipe radiator has the advantages of simple and reasonable structure, small volume, large heat radiation area, small heat resistance and good heat radiation performance, is convenient to process, manufacture, mount and arrange, and can meet heat radiation requirements of power electronic elements, such as a high-power LED (light-emitting diode) integrated packaging light source and the like.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a heat pipe radiator. Background technique [0002] With the development and maturity of LED technology, the performance index of LED has been greatly improved day by day, and it has been widely used in the field of lighting. Compared with the lighting fixtures used with general photovoltaic power sources, LED has the outstanding advantages of long life, low heat generation, not easy to damage, low power consumption and more energy saving. [0003] At present, when using light-emitting diodes, a plurality of light-emitting diodes are usually installed on an aluminum substrate in a prescribed manner to form a light-emitting diode module, and the heat is conducted through the heat-conducting surface of the aluminum substrate to the lamp housing for heat dissipation. In order to meet the heat dissipation requirements, it is often necessary to increase the heat dissipation area of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H01L33/64
Inventor 吴锏国
Owner 安徽瑞煌光电科技有限公司