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Semiconductor chip assembly with a post/base heat spreader and a signal post

A technology of semiconductors and chipsets, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, and semiconductor/solid-state device components, etc., which can solve the problems of reduced heat dissipation, limited routing capability, and excessive volume.

Inactive Publication Date: 2011-07-20
BRIDGE SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the substrate is a single-layer circuit system, the routing capability is limited, but if the substrate is a multi-layer circuit system, its excessively thick dielectric layer will reduce the heat dissipation effect
In addition, the previous technology still has problems such as insufficient heat sink performance, too large volume, or difficult thermal connection to the next layer of assembly.
The manufacturing process of the prior art is also not suitable for low-cost mass production operations

Method used

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  • Semiconductor chip assembly with a post/base heat spreader and a signal post
  • Semiconductor chip assembly with a post/base heat spreader and a signal post
  • Semiconductor chip assembly with a post/base heat spreader and a signal post

Examples

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Embodiment Construction

[0081] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0082] Figure 1 to Figure 4 It is a cross-sectional view showing a method for manufacturing a heat conduction stud 22 , a signal stud 24 and a base 26 in an embodiment of the present invention, Figure 5 and Figure 6 respectively Figure 4 top and bottom views.

[0083] figure 1 Is a cross-sectional view of a metal plate 10 comprising opposing major surfaces 12 and 14 . The illustrated metal plate 10 is a copper plate having a thickness of 330 microns. Copper has the advantages of high thermal conductivity, good bonding and low cost. The metal plate 10 can be made of various metals such as copper, aluminum, iron-nickel alloy, iron, nickel, silver, gold, mixtures thereof and alloys thereof.

[0084] figure 2 It is a cross-sectional view showing a patterned etch stop layer 16 and a fully covered etch stop layer 18 formed on the metal plate 10...

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PUM

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Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive.

Description

technical field [0001] The invention relates to a semiconductor chip group body, in particular to a semiconductor chip group body composed of a semiconductor device, a wire, an adhesive layer and a heat sink and a manufacturing method thereof. Cross-references to related applications: [0002] This application is a continuation-in-part of US Patent Application Serial No. 12 / 616,773, filed November 11, 2009, the contents of which are incorporated herein by reference. This application is also a continuation-in-part of US Patent Application No. 12 / 616,775 filed on November 11, 2009, the contents of which are also incorporated herein by reference. This application also claims priority to US Provisional Patent Application Serial No. 61 / 257,830, filed November 3, 2009, the contents of which are also incorporated herein by reference. [0003] The aforementioned U.S. Patent Application No. 12 / 616,773 filed on November 11, 2009 and the aforementioned U.S. Patent Application No. 12 / 61...

Claims

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Application Information

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IPC IPC(8): H01L23/488H01L23/36H01L23/367H01L21/60H01L33/62H01L33/64H01L25/075
CPCH01L2224/48091H01L2224/49171H01L2924/181
Inventor 林文强王家忠
Owner BRIDGE SEMICON
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