Luminescent device and method of manufacturing the same

A technology for a light-emitting device and a manufacturing method, which is applied to semiconductor devices, electrical solid-state devices, electrical components, etc., can solve the problems of reduced adhesion or sealing performance of joints, high manufacturing costs, and many manufacturing processes, and achieves reliability. , Simple manufacturing method, the effect of reducing the manufacturing process

Inactive Publication Date: 2011-07-27
SEIKO INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, since LED elements generate heat every time they emit light, expansion / contraction due to heat is repeated
Therefore, there is a problem that the adhesiveness or sealing performance of the joint part is lowered.
In addition, since separately processed parts need to be joined later, there are many manufacturing steps and high manufacturing cost.

Method used

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  • Luminescent device and method of manufacturing the same
  • Luminescent device and method of manufacturing the same
  • Luminescent device and method of manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] figure 1 The structure of the light emitting device according to this embodiment is schematically shown. figure 1 (a) is a cross-sectional view of the light emitting device, figure 1(b) is its plan view. The glass substrate 2 is in the shape of a substantially rectangular thin plate, and a substantially truncated cone-shaped depression 5 whose diameter gradually decreases from top to bottom is formed in the center thereof. Alternatively, an inner-inclined protrusion is provided on the outer peripheral portion of the glass substrate 2 , and the area surrounded by the protrusion can be regarded as the depression 5 . A plurality of through-holes 3 are formed on the glass surface of the pit 5 . The through hole 3 has a cross-sectional shape expanding from the back surface of the glass substrate 2 toward the glass surface of the recess 5 . Electrodes (not shown) are formed on the upper surface and the lower surface of the LED element 6 . The lower surface electrode i...

Embodiment 2

[0052] Figure 5 is a cross-sectional view schematically showing the light-emitting device 1 of this embodiment. In addition, descriptions that overlap with Example 1 are appropriately omitted. As shown in the figure, in this embodiment, a structure in which the glass lens 21 is integrated with the light emitting device of Embodiment 1 is adopted. The glass substrate 2 and the glass lens 21 are bonded together by the adhesive 22 coated on the top surface of the protrusion 23 of the glass substrate 2 . As shown in the figure, when the amount of the sealant 7 supplied to the recess of the glass substrate 2 is small, a gap may exist between the sealant 7 and the glass lens 21 .

[0053] According to this structure, since the light-emitting element 6 is completely sealed by the glass substrate and the glass lens, a highly durable light-emitting device can be realized. Here, a hemispherical convex lens is used, but an elliptical or concave lens may be used, or a different shape ...

Embodiment 3

[0057] Next, an embodiment in which the bottom surface of the glass lens 21 is not flat will be described with reference to the drawings. Here, "the bottom surface of the glass lens 21" refers to the surface (installation surface) on the side connected to the glass base. In addition, descriptions that overlap with Embodiment 2 are appropriately omitted.

[0058] Figure 7 A cross-sectional structure of a light emitting device in which a convex portion 24 is provided on the bottom surface of a glass lens 21 is schematically shown. As shown in the figure, the convex portion 24 of the glass lens 21 is closely fitted to the upper portion of the inclined surface of the recess of the glass base 2 (the upper portion of the inner wall surface of the protrusion 23 of the glass base 2 ). In this way, the glass substrate 2 and the glass lens 21 can be aligned with high precision by arranging the outer peripheral slope of the convex portion 24 of the glass lens 21 in contact with the sl...

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PUM

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Abstract

The invention relates to a luminescent device and a method of manufacturing the same. The luminescent device (1) in the invention comprises a glass matrix (2) made of white glass and provided with a pit in the center, through electrodes (4a,4b) formed by filling a through hole (3) equipped on the surface of the pit (5) with conductive materials, a light emitting diode element (6) installed on the through electrode (4a) and accommodated by the pit (5) and a sealant (7) for sealing the light emitting diode element (6). The reliability of the luminescent device with a luminous element carried on the glass materials is thus improved.

Description

technical field [0001] The present invention relates to a structure of a light emitting device in which a light emitting element is mounted in a package and a method of manufacturing the same. Background technique [0002] In recent years, light-emitting diode elements (hereinafter referred to as "LED elements") have been widely used in various fields after their light emission luminance and the like have been improved. For example, it is used as a backlight of a liquid crystal display device, a light-emitting element of a signal machine, an electro-optical notice board, and other lighting applications. Since LED elements can be driven with low voltage and low power consumption, and the luminous brightness is improved, it is also expected to be used in indoor lighting or automotive lighting. [0003] However, when the luminous intensity of the LED element is increased, the amount of heat generated will increase. Since the LED element is heated, its luminous efficiency will...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/56H01L33/60H01L33/00
CPCH01L24/32H01L2224/48091H01L2224/73265H01L2924/181
Inventor 林惠一郎釜森均奧定夫藤田宏之塚越功二
Owner SEIKO INSTR INC
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