LED (light-emitting diode) lamp panel adopting sputtering circuit and production method thereof
A technology of LED lamp board and sputtering, which is applied to circuits, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc. LED chip packaging process, improving production capacity, and the effect of reasonable structure
Inactive Publication Date: 2013-03-20
FORTUNE JIANGSU MULTIMEDIA
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- Application Information
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Problems solved by technology
[0002] Existing LED light boards generally use etching technology, which has low work efficiency and high pollution; traditional products have unsatisfactory heat dissipation performance, and the base plate is made of metal materials, which have defects such as heavy weight
Method used
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Embodiment Construction
[0022] A method for producing an LED lamp panel using a sputtering circuit, comprising the following steps:
[0023] (1) Use an injection molding machine to produce a polyphenylene sulfide heat dissipation substrate. The polyphenylene sulfide heat dissipation substrate is provided with copper wire placement slots and LED chip placement slots, and the positioning points for sputtering equipment and bonding equipment are reserved on the surface. The positioning points of the plating equipment and laminating equipment are at the same position10;
[0024] (2) Position the sputtering equipment on the positioning point of the sputtering equipment, and sputter the copper wire in the copper wire sputtering tank; fix the LED chip in the LED chip placement tank with crystal-fixing silver glue;
[0025] (3) Position the lamination equipment at the positioning point of the lamination equipment, and cover the cover layer with UV light to cover the upper surface of the polyphenylene sulfide...
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The invention discloses an LED (light-emitting diode) lamp panel adopting a sputtering circuit and a production method thereof, a copper conducting wire placing groove is arranged on the surface of a polyphenyl thioether heat radiation substrate, a sputtering copper conducting wire layer is arranged in the copper conducting wire placing groove, an LED wafer placing groove is arranged on the surface of the polyphenyl thioether heat radiation substrate, an LED wafer is fixed in the LED wafer placing groove through die bonding silver glue, the LED wafer is connected with the sputtering copper conducing wire through a metal conducting wire, a silica gel packaging layer for packaging the LED wafer is arranged outside the LED wafer, and a covering layer is arranged on the upper surfaces of the polyphenyl thioether heat radiation substrate and the sputtering copper conducting wire layer. A product is reasonable in structure, and a new heat conduction material is utilized and can be used for replacing a traditional metal material (aluminum and the like) for reducing the weight of the product. A sputtering machine for producing optical discs is utilized for sputtering a copper / silver circuit, a traditional etching process can be replaced, the yield can be upgraded, the environment can be protected, and the pollution can be reduced.
Description
technical field [0001] The invention relates to an LED lamp board and a production method thereof. Background technique [0002] Existing LED light boards generally use etching technology, which has low work efficiency and high pollution; traditional products have unsatisfactory heat dissipation performance, and the base plate is made of metal materials, which has defects such as heavy weight. Contents of the invention [0003] The object of the present invention is to provide an LED lamp board with a reasonable structure, simple process and reduced pollution and adopts a sputtering circuit and a production method thereof. [0004] Technical solution of the present invention is: [0005] An LED lamp board using a sputtering circuit is characterized in that it includes a polyphenylene sulfide heat dissipation substrate, a copper wire placement groove is arranged on the surface of the polyphenylene sulfide heat dissipation substrate, a sputtered copper wire layer is arrange...
Claims
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IPC IPC(8): H01L33/48H01L33/62H01L33/64H01L33/00F21V29/00F21Y101/02F21V29/503F21V29/70F21Y115/10
CPCH01L2224/48091H01L2224/73265
Inventor 邓衔翔李强花赟李华
Owner FORTUNE JIANGSU MULTIMEDIA