Cyclical chemical plating process for preparing palladium or palladium alloy film
A palladium alloy film and chemical plating technology, applied in the field of chemical plating technology, can solve the problems of high cost of the supported palladium film, loss of development and application value, limited source of porous materials, etc. The effect of low shear force
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Embodiment 1
[0028] A kind of circulation electroless plating process of preparing palladium film, comprises the following steps:
[0029] (1) The substrate used is a tubular porous ceramic substrate with an outer diameter of 12 mm, an inner diameter of 8 mm, a length of 75 mm, and a maximum pore diameter of 3 μm on the surface. It was cleaned and dried for later use.
[0030] (2) Using SnCl 2 / PdCl 2 The surface of the substrate is activated by the method, in which the sensitization solution contains SnCl 2 5 g / L, concentrated hydrochloric acid 1 mL / L, the activation solution contains PdCl 2 0.2 g / L, concentrated hydrochloric acid 1 mL / L, sensitization-activation treatment 6 times.
[0031] (3) if figure 2 1. Seal both ends of the activated substrate with rubber plugs and immerse in the palladium plating solution. The feed port of the peristaltic pump extends into the inner bottom of the substrate through the upper rubber plug, and the discharge port leads into the plating tank. D...
Embodiment 2
[0035] According to the method substantially identical with embodiment 1, adopt cyclic chemical plating process to prepare palladium membrane, but the surface maximum pore diameter of porous ceramic substrate is 2.5 μ m, the palladium plating solution used for preparing palladium membrane by cyclic electroless plating consists of: PdCl 2 4.5 g / L, Na 2 EDTA 70 g / L, 25% concentrated ammonia water 300 ml / L, N 2 h 4 0.5 mol / L, palladium film thickness is 6 μm.
[0036] The nitrogen leakage rate of the prepared palladium membrane was 1 ml / min at room temperature and 1 bar.
Embodiment 3
[0038] According to the same method as in Example 1, the palladium membrane was prepared by a cyclic electroless plating process, but the substrate used was a porous stainless steel tube with a maximum surface pore size of 4 μm. Before the matrix activation, it was pre-oxidized in air at 400 °C for 8 h.
[0039] The substrate activation and palladium film preparation are the same as the steps (2), (3), (4) and (5) of Example 1, but the prepared palladium film has a thickness of 8 μm and a nitrogen leakage rate of 2 at 1 bar at room temperature. ml / min.
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