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Method for manufacturing a touch panel, and touch panel manufactured by same

A technology of touch panel and manufacturing method, which is applied in printed circuit manufacturing, removal of conductive materials by chemical/electrolytic methods, input/output process of data processing, etc., and can solve the problem of reducing the durability of touch panels, reducing device integration, and inspection Problems such as difficult process, to achieve the effect of reducing unqualified rate, reducing manufacturing cost, and reducing manufacturing cost

Inactive Publication Date: 2011-08-31
SHINWA ELECTRONICS IND +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the case of using silver paste to form wires, there is a limit to coating the silver paste thinner, so the thickness of the wire becomes thicker, resulting in a large difference in height in the up and down direction, and the thickness of the wire in the planar direction. The widening of the width of the touch panel has the following problems of reducing the durability of the touch panel and reducing the integration of the device. In the case of the silver paste process, it is necessary to cure it at a high temperature after the silver paste is applied. In this high-temperature curing process, an annealing process is required in order to prevent the deformation of the pattern, so there are problems of complicated processes and increased costs.
[0005] Moreover, it is difficult to recognize the ITO pattern with the naked eye after the ITO pattern is formed, so the general processing method is to perform functional inspection and appearance inspection after printing the silver paste. As a result, the silver paste printing process is also performed on defective products, so there is a problem of increased costs. In the case of inspection after forming the ITO pattern, it is difficult to identify the ITO pattern with the naked eye and the inspection process is difficult. And in the inspection problems such as damage to ITO

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  • Method for manufacturing a touch panel, and touch panel manufactured by same
  • Method for manufacturing a touch panel, and touch panel manufactured by same
  • Method for manufacturing a touch panel, and touch panel manufactured by same

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Embodiment Construction

[0023] Hereinafter, the present invention will be described in detail with reference to the drawings.

[0024] The present invention relates to a method for manufacturing a touch panel. The method for manufacturing a touch panel includes: a first step, comprising an insulator layer made of an organic insulator or an inorganic insulator, a transparent conductive substance coating formed on the upper surface of the insulator layer, And on the upper surface of the touch panel manufacturing liner of the metal coating formed on the upper surface of the transparent conductive material coating, the metal coating and the transparent conductive material coating are etched, thereby manufacturing and forming retention and metal electrodes. pattern and transparent conductive material electrode pattern in a corresponding pattern of all parts of the liner; the second step is to only etch the metal coating on the upper surface of the liner formed with the above pattern, thereby manufacturing ...

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Abstract

The present invention relates to a method for manufacturing a touch panel, and a touch panel manufactured by the same. The method for manufacturing a touch panel comprises: a first step of etching both a metal coating layer and a transparent conductive material coating layer on an upper surface of a pad for manufacturing the touch panel, including an insulator layer made of an organic or inorganic insulator, the transparent conductive material coating layer formed on the insulator layer, and the metal coating layer formed on the transparent conductive material coating layer, to produce a pad having a pattern where either a metal conductive electrode pattern or a transparent conductive material electrode pattern fully remains; a second step of etching only the metal coating layer on the upper surface of the pad where the pattern is formed to produce a pad having the metal coating layer pattern where only the portion corresponding to the metal electrode pattern remains from the metal coating layer remaining in the first step; and a third step of i) coupling an adhesive layer and a dielectric layer made of an insulator onto the upper surface of the pad with the pattern, or ii) turning the upper side of another pad down with the pattern and coupling another pad onto the upper surface of the pad with the pattern in such a manner that the two pads are vertically spaced apart from each other. The touch panel of the present invention can be manufactured through processes simplified as compared to conventional processes where a silver paste is applied. Further, the present invention enables the pattern of transparent conductive material coating layer to be discriminated with the naked eye, and thus enables a function test and a visual test to be easily performed during the process, resulting in reductions in the defect ratio and in the manufacturing costs.

Description

technical field [0001] The present invention relates to a method for manufacturing a touch panel and a touch panel manufactured using the method, which can be produced in a uniform process that is simpler than the existing process of applying silver paste, and can recognize the pattern of a transparent conductive material coating with the naked eye. Therefore, functional inspection and visual inspection can be easily performed in the process, and the failure rate can be reduced and the manufacturing cost can be reduced. Background technique [0002] In the case of a spacer for a general touch panel, glass coated with a transparent conductive material such as ITO (especially in the case of a resistive film method) or insulating resin (resistive film method or In the case of the electrostatic capacitive method), it is made into a transparent structure, and the material layer such as the above-mentioned ITO may be formed on the flat plate in a certain pattern instead of being u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041
CPCH05K2203/0361H05K3/244G06F3/045H05K2201/0326H05K3/06G06F3/044H05K1/09G06F3/0443G06F3/041G06F2203/04103
Inventor 朴准永郑州铉金世玄裵相模
Owner SHINWA ELECTRONICS IND