Silicon-substrate-radiation-based light emitting diode (LED) package structure and manufacturing method

Abstract

The invention discloses a silicon-substrate-radiation-based light emitting diode (LED) package structure, which consists of a silicon substrate with a groove, an LED chip with a vertical structure, a P electrode metal layer, a welding metal layer, a SiO2 insulating layer and an N electrode. The invention also discloses a silicon-substrate-radiation-based high-power multi-chip LED package structure with the structure and a manufacturing method thereof. The silicon-substrate-radiation-based LED package structure and the manufacturing method have the advantages that: in the structure, a through hole is not required to be machined on the back of a heat sink which is the silicon substrate so as to simplify a process, and a bottom surface can be directly welded onto a metal radiation plate; andthe structure provided by the invention has the advantages of low thermal resistance and low cost, and is easy to maintain.

Description

technical field [0001] The invention relates to an LED packaging technology, in particular to an LED packaging structure and a manufacturing method based on silicon-based heat dissipation. Background technique [0002] In recent years, the research hotspot at home and abroad is to use modular high-power LED multi-chip arrays as the basic unit for lamp assembly. The existing technology mostly uses a metal PCB board package composed of a three-layer structure of a circuit layer, an insulating medium layer, and an Al or Cu heat dissipation layer. figure 1 It is a schematic diagram of the LED package section of the metal PCB board. The conductive layer and the insulating medium layer at the position of the soldered LED tube core are removed, and the LED is soldered on a high-resistance, thermally matched transitional heat sink, and then directly mounted on the Metal heat dissipation layer, this kind of structure process is relatively complicated, and it is not easy to expan...

AI Technical Summary

Problems solved by technology

The existing technology mostly uses a metal PCB board package composed of a three-layer structure of a circuit layer, an insulating medium layer, and an Al or Cu heat dissipation layer. figure 1 It is a schematic diagram of the LED package section of the metal PCB board. The conductive layer and the insulating medium layer at the position of the soldered LED tube core are removed, and the LED is soldered on a high-resistance, thermally matched transitional heat sink, and then directly mounted on the Metal heat dissipation layer, this kind of structure process is relatively complicated, and it is not easy to expand into an arrayed packaging form; figure 2 For the existing Si-based heat-dissipating LED packaging structure, the double-sided overlay photolithography is used, and the front reflection cavity and the back metal connection hole need to be etched out, and the process is complicated.

[0003] Some foreign companies have also achieved certain results in this research. For example, the ceramic series products specially used for high-power LED packaging launched by Japan's Kyocera, the material is made of Al 2 o 3 or AlN ceramic material, but Al 2 o 3 1. The cost of AlN is relatively high, and the problem of complex process is still not solved; there is also a silicon-based package heat sink product provided by Germany's Hymite company. connection, its technological complexity is comparable to that of the products of Japanese companies, and it is not inferior

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