Super high-density perpendicular magnetic recording magnetic film and preparation method thereof
A perpendicular magnetic recording, ultra-high density technology, applied in the direction of magnetic recording, coating only a part of the coating supported by a magnetic layer, data recording, etc. Mass production and other problems, to achieve the effect of easy operation, good chemical stability and easy operation in the production process
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Embodiment 1
[0024] (1) Clean the single crystal silicon wafer: use hydrofluoric acid with a concentration of 5% to remove the oxide layer on the surface, and then use a volume ratio of NH 3 ·H 2 O:H 2 0 2 :H 2 0=1:1:4 cleaning solution, ultrasonic cleaning at a temperature of 90°C for 30 minutes; then use a volume ratio of HCL:H 2 o 2 :H 2 0=1:0.5:4 cleaning solution, ultrasonic cleaning at 90°C for 30 minutes to remove organic and metal attachments on the surface of the silicon wafer; finally placed in absolute ethanol, ultrasonic cleaning for 30 minutes to remove the substrate surface attached moisture.
[0025] (2) Depositing magnetic thin films by magnetron sputtering: place a SmCo permanent magnet with a surface magnetic field strength of 0.5 T on the back of the cleaned single crystal silicon substrate, when the vacuum in the magnetron sputtering chamber is 3×10 -5 Pa, when the argon pressure is 0.7Pa, the Co 0.84 Fe 0.01 PtC 0.15 For thin film deposition, the single cryst...
Embodiment 2
[0031] (1) Clean the single crystal silicon wafer: use hydrofluoric acid with a concentration of 20% to remove the oxide layer on the surface, and then use a volume ratio of NH 3 ·H 2 O:H 2 0 2 :H 2 0=1:3:5.5 cleaning solution, ultrasonic cleaning at a temperature of 70°C for 50 minutes; then use a volume ratio of HCL:H 2 o 2 :H 20=1:2:7 cleaning solution, ultrasonic cleaning at 70°C for 50 minutes to remove organic and metal attachments on the surface of the silicon wafer; finally placed in absolute ethanol, ultrasonic cleaning for 50 minutes to remove the substrate surface attached moisture.
[0032] (2) Deposit magnetic thin films by magnetron sputtering: place a NdFeB permanent magnet with a surface magnetic field strength of 1T on the back of the cleaned single crystal silicon substrate, when the vacuum in the magnetron sputtering chamber is 8×10 -5 Pa, when the argon pressure is 0.9Pa, the Co 0.19 Fe 0.01 PtC 0.15 film deposition, and control the rotation speed...
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