Method for preparing copper-aluminum-copper compound board

A composite plate, composite plate technology, applied in the direction of chemical instruments and methods, metal rolling, manufacturing tools, etc., can solve the problems such as the bonding strength of the easily oxidized copper/aluminum interface

Inactive Publication Date: 2011-10-05
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the above-mentioned deficiencies in the prior art, and provides a method for preparing a copper-aluminum-copper composite plate, by pouring molten aluminum into the middle of two parallel copper alloys at room temperature to form a copper-aluminum-copper three-layer The blank part solves the problem of low copper / aluminum interface bonding strength caused by the easy oxidation of the copper surface, so that the interface bonding strength of the copper / aluminum composite plate can be increased by nearly 3 times compared with direct plane butt rolling

Method used

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  • Method for preparing copper-aluminum-copper compound board
  • Method for preparing copper-aluminum-copper compound board
  • Method for preparing copper-aluminum-copper compound board

Examples

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Embodiment 1

[0020] Such as figure 1 As shown, this embodiment includes the following steps:

[0021] Step 1: Copper surface treatment

[0022] Divide 0.8×50×150mm 3 The annealed HNi65-5 nickel brass is soaked in 10-20% sulfuric acid solution for 4 minutes to remove the oxide film on the surface, then rinse the surface with water and dry it. Sand the surface with a rolling brush.

[0023] Step 2: Preparation of copper-aluminum-copper three-layer board blank

[0024] Prepare a simple fixed mold, as attached figure 2 . Fix the polished nickel-brass alloy on two parallel surfaces of the fixed mold, and the distance between the copper alloys is 3 mm. Polish the surface of 1050 industrial pure aluminum, put it into a ceramic crucible, put it into a well-type heat treatment test furnace, and melt it at 760 °C. Cast the molten aluminum into a fixed mold at room temperature, and take out the copper-aluminum-copper three-layer blank after cooling. The prepared blank is placed in an atmosph...

Embodiment 2

[0030] Such as figure 1 As shown, this embodiment includes the following steps:

[0031] Step 1: Copper surface treatment

[0032] 2×50×150mm 3 The annealed HNi65-5 nickel brass is soaked in 10-20% sulfuric acid solution for 4 minutes to remove the oxide film on the surface, then rinse the surface with water and dry it. Sand the surface with a rolling brush.

[0033] Step 2: Preparation of copper-aluminum-copper three-layer board blank

[0034] Prepare a simple fixed mold, as attached figure 2 . Fix the polished nickel-brass alloy on two parallel surfaces of the fixed mold, and the distance between the copper alloys is 20 mm. Polish the surface of 1050 industrial pure aluminum, put it into a ceramic crucible, put it into a well-type heat treatment test furnace, and melt it at 760 °C. Cast the molten aluminum into a fixed mold at room temperature, and take out the copper-aluminum-copper three-layer blank after cooling. The prepared blank is placed in an atmosphere-prot...

Embodiment 3

[0040] Such as figure 1 As shown, this embodiment includes the following steps:

[0041] Step 1: Copper surface treatment

[0042] 1.5×50×150mm 3 The annealed HNi65-5 nickel brass is soaked in 10-20% sulfuric acid solution for 4 minutes to remove the oxide film on the surface, then rinse the surface with water and dry it. Sand the surface with a rolling brush.

[0043] Step 2: Preparation of copper-aluminum-copper three-layer board blank

[0044] Prepare a simple fixed mold, as attached figure 2 . Fix the polished nickel-brass alloy on two parallel surfaces of the fixed mold, and the distance between the copper alloys is 13 mm. Polish the surface of 1050 industrial pure aluminum, put it into a ceramic crucible, put it into a well-type heat treatment test furnace, and melt it at 760 °C. Cast the molten aluminum into a fixed mold at room temperature, and take out the copper-aluminum-copper three-layer blank after cooling. The prepared blank is placed in an atmosphere-pr...

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Abstract

The invention belongs to the technical field of compound materials, and discloses a method for preparing a copper-aluminum-copper compound board. The method comprises the following steps of: vertically arranging two copper alloys of which the surfaces are subjected to cleaning pretreatment opposite to each other, pouring the molten aluminum liquid between two copper alloys to obtain an alloy blank, heating the alloy blank, rolling to obtain a copper-aluminum-copper three-layer compound board, and performing post-rolling processing on the copper-aluminum-copper three-layer compound board to obtain the copper-aluminum-copper compound board. The method solves the problems that the bonding strength of a cooper-aluminum interface is low because the surface of copper is easy to oxidize; and by the method, the bonding strength of the cooper-aluminum compound board interface can be improved by about 3 times to the maximum compared with that of the direct plane butt joint rolling method.

Description

technical field [0001] The invention relates to an alloy plate in the technical field of composite materials and a preparation method thereof, in particular to a method for preparing a copper-aluminum-copper composite plate. Background technique [0002] Composite materials composed of two or more materials have different physical, chemical, mechanical properties and prices than single materials, and have many advantages that single materials do not have. They are widely used in aviation, petroleum, and chemical industries. , shipbuilding, automobiles, electronics and other industrial fields. As a new type of composite material, copper-aluminum composite material is composed of copper or copper alloy and aluminum or aluminum alloy through a certain manufacturing process. It has the advantages of high electrical and thermal conductivity of copper, low contact resistance and light weight of aluminum. At the same time, it avoids the shortcomings of copper resource shortage, hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B21B47/00B21B1/38B22D19/16
Inventor 何国谭庆彪张敏达何献忠
Owner SHANGHAI JIAO TONG UNIV
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