Electronic packing method of vertical chips
An electronic packaging and chip technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of large size and unfavorable automatic production, etc., achieve good adaptability, reduce packaging costs, and improve packaging yield.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0041] Example 1
[0042] Such as figure 1 with Figure 7 As shown: the packaging structure formed by the packaging method of the present invention includes a bottom plate 71. The bottom plate 71 corresponds to the surface where the bottom plate lead pads 72b are provided with a first vertical chip 76 mounted on the surface. The first vertical chip 76 is bonded The body 74 is vertically installed on the bottom plate 71, and the adhesive body 74 is an adhesive sheet or tape; specifically, the first vertical chip surface 76 a of the first vertical chip 76 is perpendicular to the bottom plate 71. A first horizontal chip 77 and a second horizontal chip 78 are mounted on the bottom plate 71. The second horizontal chip 78 is mounted on the bottom plate 71 through an adhesive body 74, and the first horizontal chip 77 is mounted on the second level through an adhesive body 74. On the chip 78, the surfaces of the first horizontal chip 77 and the second horizontal chip 78 are parallel to t...
Example Embodiment
[0047] Example 2
[0048] Such as Picture 10 Shown: only one chip is set on the bottom plate 71, the second vertical chip 87; that is, the second vertical chip surface 87a of the second vertical chip 87 is perpendicular to the bottom plate 71, and one end of the second vertical chip 87 is mounted on the bottom plate through the adhesive 74 On the bottom plate 71. The second vertical chip 87 has a second vertical chip surface 87a and a second vertical chip top side 87c. The second vertical chip surface 87a is a surface where functional devices are fabricated. The second vertical chip top side 87c is parallel to the bottom plate 71. A straight side lead pad 72f is formed on the top side 87c of the second vertical chip, and the straight side lead pad 72f is electrically connected to the electronic device on the second vertical chip 87. The straight-side lead solder bump 72f is parallel to the bottom plate 71, and the straight-side lead solder bump 72f and the bottom lead solder bu...
Example Embodiment
[0056] Example 3
[0057] Such as Figure 22 As shown: a fourth horizontal chip 94 is installed on the bottom plate 71, and the fourth horizontal chip 94 is distributed parallel to the bottom plate 71, and the fourth horizontal chip 94 is mounted on the bottom plate 71 through an adhesive body 74. A fourth vertical chip 98 is also installed on the bottom plate 71, the fourth vertical chip surface 98 a of the fourth vertical chip 98 is perpendicular to the bottom plate 71, and the fourth vertical chip 98 is mounted on the bottom plate 71 through an adhesive 74. The fourth vertical chip 98 has a fourth vertical chip surface 98a, a fourth vertical chip vertical side 98b, and a fourth vertical chip top side 98c, wherein the fourth vertical chip vertical side 98b is adjacent to the end of the fourth horizontal chip 94; The vertical chip surface 98 a and the fourth vertical chip vertical side 98 b are both perpendicular to the bottom plate 71, and the fourth vertical chip top side 98 c...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap