LED encapsulation process

Abstract

The invention relates to a light emitting diode (LED) encapsulation process, which comprises the following steps of: (1) performing die bonding, namely placing an LED chip in the middle of a substrate coated with a die bonding adhesive; (2) curing a bonded die, namely baking the LED chip which is subjected to the die bonding, and drying the die bonding adhesive, so that the LED chip is fixed in the middle of a bowl cup of the substrate; (3) welding wires, namely connecting a positive electrode and a negative electrode of the LED chip with a positive electrode support and a negative electrode support electrically by using gold wires; (4) performing dam enclosing, namely fixing the periphery of the LED chip by using a dam enclosing adhesive; (5) coating and curing a transparent adhesive, namely coating a layer of transparent adhesive at the periphery of the LED chip which is subjected to wire welding, and baking the LED chip coated with the transparent adhesive, so that the transparent adhesive is cured; (6) coating and curing fluorescent powder, namely coating a layer of fluorescent powder on the cured transparent adhesive, baking the LED chip coated with the fluorescent powder, so that the fluorescent powder is cured, and repeating the two steps (5) and (6) until light colors emitted by an LED lamp meet the requirement of color temperature; and (7) encapsulating, namely encapsulating a layer of transparent silica gel on the required LED substrate.

Description

technical field [0001] The invention relates to an LED encapsulation process, in particular to the improvement of a process method for coating an LED fluorescent powder. Background technique [0002] LED (Light Emitting Diode, light-emitting diode) is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electrical energy into light energy. LED is widely used as a new lighting source material. The LED packaging technology plays a key role in the light-emitting efficiency of light-emitting diodes. At present, the technologies for improving the luminous efficiency of high-power LED packaging for lighting can be roughly divided into the following categories: 1. The luminous efficiency of the chip itself is directly used, but the luminous efficiency of the chip itself is limited and the cost is high; 2. The use of Coat the substrate with large-grained phosphor, and form it with one-time dispensing, but the large-g...

AI Technical Summary

Problems solved by technology

At present, the technologies for improving the luminous efficiency of high-power LED packaging for lighting can be roughly divided into the following categories: 1. The luminous efficiency of the chip itself is directly used, but the luminous efficiency of the chip itself is limited and the cost is high; 2. The use of Apply large-grained phosphor substrates, one-time dispensing and forming, but the large-grained phosphors are easy to precipitate and cause uneven spots, resulting in serious color temperature differences

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