Manufacturing process of PCB (Printed Circuit Board)

A manufacturing process and PCB board technology, applied in the direction of electrical connection formation of printed components, coating of non-metallic protective layer, secondary treatment of printed circuits, etc., can solve the problem of ink burst hole, plug hole ink expansion and ejection, which cannot be completely improved Explosion problems and other problems, to achieve the effect of low cost, high yield, and avoid expansion and explosion

Inactive Publication Date: 2011-11-16
惠州中京电子科技股份有限公司
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  • Summary
  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] In the existing plugging process, after plugging, the ink in the hole is dried by baking to avoid its flow, but the baking method can only dry the solder resist oil layer on the surface of the plug hole, and the ink in the center of the hole remains before post-curing. In a fluid state, the properties and viscosity of different types of inks and the high-temperature baking in the post-curing step will directly cause the plugging ink to expand and pop out due to heat, forming a bad phenomenon of ink bursting
Aiming at the blowout phenomenon, the industry has introduced many improvement measures, such as canceling the problematic plug hole, modifying the problematic FILM, secondary exposure, etc., but it still cannot completely improve the blowout problem

Method used

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Embodiment Construction

[0014] In order to facilitate the understanding of those skilled in the art, the process of the present invention will be further described in detail below in conjunction with specific embodiments.

[0015] The PCB manufacturing process disclosed in the present invention mainly adds a UV light curing step after the ink is plugged into the hole. Among them, the temperature in the UV light room needs to be controlled at less than or equal to 60°C, and both sides of the PCB board are subjected to UV light at the same time. The purpose of lower temperature control in the UV light room is to form a refrigeration system in the light room to cool the UV lamp tubes, so as to reduce the temperature of the UV light. The temperature in the UV light room is too high, and the liquid state of the ink in the PCB hole is strong, which is prone to oil leakage in the hole. Simultaneous UV light on both sides can allow ultraviolet light to penetrate into the hole in both directions, so that the...

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PUM

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Abstract

The invention relates to a manufacturing process of a PCB (Printed Circuit Board), in particular to a soldmask hole-plugging procedure of the PCB. The manufacturing process comprises the steps of: (1) soldmask pretreatment; (2) ink hole plugging of a PCB; (3) prebaking; (4) exposure; (5) development; (6) appearance inspection (7) UV (ultraviolet light irradiation) of the PCB for curing ink for hole plugging; and (8) postcuring of the PCB. According to the manufacturing process, the step of UV light irradiation is added to the soldmask hole plugging procedure of the PCB, thereby not only achieving a strong light curing effect on the ink in the plugging hole of the PCB, but also better curing the soldmask ink on the surface of the board; and the problem of popping in the post procedure can be effectively avoided, the falling of the soldmask ink on the surface of the board in the post procedure is prevented, the product quality of the finished PCB can be guaranteed, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of PCB production, in particular to the solder-proof plug hole process of the PCB board. Background technique [0002] Modern electronic products are increasingly developing in the direction of miniaturization, high integration, and high performance, and the design of printed circuit boards is becoming more and more difficult. The design of PAD points tangent and intersecting with holes on the circuit board is relatively increased. The above structure needs to plug the via holes on the circuit board to avoid solder beads flowing to the opposite side through the holes during wave soldering, affecting the performance of components or Cause a short circuit; In addition, the plug hole can also protect the via hole, reduce or delay the corrosion of the hole wall in the board application. According to statistics, general PCB manufacturers need plugged holes for their circuit board products, accounting for more than 85% of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K3/40
Inventor 周刚刘冬赵志平
Owner 惠州中京电子科技股份有限公司
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