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Controlled silicon device provided with secondary conductive path and triggered with help of diodes

A diode-assisted, secondary conduction technology, applied in diodes, semiconductor devices, electric solid-state devices, etc., can solve problems such as latch-up effect and low clamping voltage, and achieve uniform current, simple structure, and optimized connection and layout.

Inactive Publication Date: 2013-04-17
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The diode-assisted trigger thyristor combines the low turn-on voltage of the diode and the high ESD protection capability of the thyristor to become an excellent ESD protection device, but the diode-assisted trigger thyristor still has a clamping voltage that is too low , it is prone to the risk of latch-up effect, and it needs to be improved by increasing the clamping voltage or increasing the current value of the clamping point

Method used

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  • Controlled silicon device provided with secondary conductive path and triggered with help of diodes
  • Controlled silicon device provided with secondary conductive path and triggered with help of diodes
  • Controlled silicon device provided with secondary conductive path and triggered with help of diodes

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Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with the embodiments and accompanying drawings, but the present invention is not limited thereto.

[0022] Such as figure 2 As shown, a diode-assisted triggering thyristor device with a secondary conduction path includes a P-type substrate 21, wherein the P-type substrate 21 is sequentially provided with a first P+ implant region 22, a first N+ implant region region 23, the first N well 24, the second N well 25 and the third N well 26; the first N well 24 is provided with a second P+ implant region 24a, a second N+ implant region 24b and a third P+ implant region 24c in sequence A fourth P+ implantation region 25a and a third N+ implantation region 25b are sequentially provided on the second N well 25, and a fifth P+ implantation region 26a and a fourth N+ implantation region 26b are sequentially provided on the third N well 26;

[0023] The first P+ implantation region 22, the first N+ implantatio...

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Abstract

The invention discloses a controlled silicon device provided with a secondary conductive path and triggered with the help of diodes. The connection and the layout of controlled silicon and diodes are optimized, and a parasitic controlled silicon path formed by diode strings is adopted to realize the secondary conduction of the controlled silicon which is triggered with the help of the diodes, thus improving a current value of a clamp point when the voltage of the controlled silicon is clamped so as to avoid the occurrence of the latch-up. The silicon controlled device is simple in structure, even in current and good in robustness, and is stable and reliable. Compared with a traditional ESD (electronic static discharge) protection scheme of diodes and MOS (metal oxide semiconductor) tubes,the controlled silicon device provided by the invention is superior in area efficiency; and compared with a traditional protection scheme for controlled silicon triggered with the help of diodes, thecontrolled silicon device provided by the invention has the advantage of low latch-up risk.

Description

technical field [0001] The invention belongs to the field of integrated circuits, and in particular relates to a thyristor device used for ESD protection of integrated circuits in a low operating voltage domain. Background technique [0002] The phenomenon of electrostatic discharge (ESD) in nature poses a serious threat to the reliability of integrated circuits. In the industry, 30% of the failures of integrated circuit products are caused by electrostatic discharge, and the increasingly smaller process size and thinner gate oxide thickness greatly increase the probability of integrated circuit damage by electrostatic discharge. Therefore, improving the reliability of integrated circuit electrostatic discharge protection has a non-negligible effect on improving the yield of products. [0003] The modes of electrostatic discharge phenomena are usually divided into four types: HBM (Human Body Model), MM (Machine Discharge Model), CDM (Component Charge Discharge Model) and Fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/02H01L29/87H01L29/06
CPCH01L29/87
Inventor 苗萌董树荣吴健曾杰韩雁马飞郑剑锋
Owner ZHEJIANG UNIV
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