Method for encapsulating MEMS (micro electro mechanical system) high-range acceleration sensor

An acceleration sensor and packaging method technology, applied in decorative arts, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of poor resistance to high overload, poor packaging reliability, low natural frequency, etc., to improve reliability and reliability. high sex effect

Active Publication Date: 2014-06-25
ZHONGBEI UNIV
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of poor high overload resistance, low natural frequency, and poor packaging reliability of the existing sensor packaging technology, the present invention provides a packaging method for MEMS high-range acceleration sensors

Method used

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  • Method for encapsulating MEMS (micro electro mechanical system) high-range acceleration sensor
  • Method for encapsulating MEMS (micro electro mechanical system) high-range acceleration sensor
  • Method for encapsulating MEMS (micro electro mechanical system) high-range acceleration sensor

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Embodiment Construction

[0015] A packaging method for a MEMS high-range acceleration sensor, the method is realized by the following steps:

[0016] a) A borosilicate glass substrate 2 is anodically bonded on the upper and lower surfaces of the chip 1 of the MEMS high-range acceleration sensor, and the thickness of the two borosilicate glass substrates 2 is equal;

[0017] b) Select the ceramic substrate 3, the thickness of the ceramic substrate 3 is equal to the sum of the thickness of the chip 1 and the thickness of the high borosilicate glass substrate 2, and fix the ceramic substrate 3 and the chip 1 on the buffer substrate 4 to ensure that the fixed ceramic substrate 3 and The chip 1 is on the same level, and the distance between the ceramic substrate 3 and the chip 1 is compact;

[0018] c) Print the chip pad 5 on the chip 1 by screen printing technology, use the mold to print the pad 6 for the cable lead on the ceramic substrate 3, and print between the chip pad 5 and the pad 6 for the cable l...

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Abstract

The invention relates to a sensor encapsulating technology, in particular to a method for encapsulating an MEMS (micro electro mechanical system) high-range acceleration sensor. According to the invention, the problem that the existing sensor encapsulating technology has poor high overload resistance, low natural frequency and poor encapsulating reliability can be solved. The method for encapsulating the MEMS high-range acceleration sensor is realized in the following steps of: a) bonding a high borosilicate glass substrate on an anode; b) selecting a ceramic substrate; c) printing chip bonding pads and connecting wires; d) fixing a buffering substrate into a stainless steel encapsulation tube shell; e) welding a cable lead; f) filling and sealing the stainless steel encapsulation tube shell; and g) seaming and connecting a stainless steel cover plate onto the stainless steel encapsulation tube shell. By using the technology in the invention, the problem that the existing sensor encapsulating technology has low high overload resistance, low natural frequency and poor encapsulating reliability can be effectively solved and the technology is applicable to encapsulation of the MEMS high-range acceleration sensor.

Description

technical field [0001] The invention relates to a sensor packaging technology, in particular to a packaging method for a MEMS high-range acceleration sensor. Background technique [0002] MEMS (micro-electromechanical system-based) high-range acceleration sensors have attracted much attention due to their small size, light weight, low cost, and high reliability, especially in aerospace and aerospace applications that have high requirements for device volume, quality, and reliability. There are great application prospects in the field of weapon science. Research on MEMS high-range acceleration sensors has developed rapidly in recent years, and high-range acceleration sensors with various performances and ranges have been reported one after another. However, unlike low-range acceleration sensors, high-range acceleration sensors have high requirements for high overload resistance and natural frequency. Usually, the high overload resistance requires that it can withstand hundre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00
Inventor 石云波刘俊唐军杨玉华李平张贺
Owner ZHONGBEI UNIV
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