Method for encapsulating MEMS (micro electro mechanical system) high-range acceleration sensor
An acceleration sensor and packaging method technology, applied in decorative arts, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of poor resistance to high overload, poor packaging reliability, low natural frequency, etc., to improve reliability and reliability. high sex effect
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[0015] A packaging method for a MEMS high-range acceleration sensor, the method is realized by the following steps:
[0016] a) A borosilicate glass substrate 2 is anodically bonded on the upper and lower surfaces of the chip 1 of the MEMS high-range acceleration sensor, and the thickness of the two borosilicate glass substrates 2 is equal;
[0017] b) Select the ceramic substrate 3, the thickness of the ceramic substrate 3 is equal to the sum of the thickness of the chip 1 and the thickness of the high borosilicate glass substrate 2, and fix the ceramic substrate 3 and the chip 1 on the buffer substrate 4 to ensure that the fixed ceramic substrate 3 and The chip 1 is on the same level, and the distance between the ceramic substrate 3 and the chip 1 is compact;
[0018] c) Print the chip pad 5 on the chip 1 by screen printing technology, use the mold to print the pad 6 for the cable lead on the ceramic substrate 3, and print between the chip pad 5 and the pad 6 for the cable l...
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