Gravity balancing device on Z-direction working platform and cutting machine

Abstract

The invention provides a gravity balancing device on a Z-direction working platform, and an elastic device fixed on a base and can provide an upward force for a slide carriage. The embodiment of the invention also provides a cutting machine which comprises a Z-direction working platform, wherein the Z-direction working platform comprises a base, a screw which can be rotatably arranged on the base, and a slide carriage which is arranged on the screw and can be driven by the screw to move relative to the base; and the Z-direction working platform is provided with a gravity balancing device. When a moving part of the Z-direction working platform provided with the gravity balancing device reciprocates, the elastic device fixed on the base supplies an upward force to balance the downward gravity of the moving load, thus the problem that the screw cannot be locked automatically is solved, and the adverse effect of the load gravity is eliminated simultaneously. As for the cutting machine provided by the invention, the Z-direction working platform thereof is provided with the gravity balancing device, thus the problem that the screw cannot be locked automatically is solved, and the adverse effect of load gravity is eliminated simultaneously. The cutting machine runs with lower noise, is particularly suitable for high-speed and high-precision cutting, and greatly reduces the manufacturing cost.

Description

technical field

[0001] The invention relates to a device for avoiding or reducing unbalanced force, in particular to a gravity balance device on a Z-direction workbench and a cutting machine. Background technique

[0002] The cutting machine is a special equipment for semiconductor post-packaging, which is mainly used for the division and cutting of silicon integrated circuits, light-emitting diodes, piezoelectric ceramics, quartz, lithium niobate, gallium arsenide, glass, sapphire, alumina and iron oxide . The cutting machine is a device that drives the diamond blade to rotate at high speed through the high-speed aerostatic spindle, and cuts or grooves the wafer along the cutting road. During the working process, the moving parts of the Z-direction table of the equipment drive the aerostatic spindle to make frequent and rapid reciprocating movements along the vertical direction during the cutting process, and to make low-speed movements during the tool height measurement p...

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